| 11424152 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2022-08-23 |
$8,523,000 |
| 11127715 |
Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same |
Paul S. Andry, Mark D. Schultz |
2021-09-21 |
$21,372,000 |
| 10625257 |
Direct bond transfer layers for manufacturable sealing of microfluidic chips |
Joshua T. Smith, Chao Wang, Benjamin H. Wunsch |
2020-04-21 |
$2,793,000 |
| 10381255 |
Double layer release temporary bond and debond processes and systems |
Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker |
2019-08-13 |
$1,909,000 |
| 10347588 |
Thin 3D die with electromagnetic radiation blocking encapsulation |
Paul S. Andry, Adam Toner |
2019-07-09 |
$2,201,000 |
| 10297479 |
Wafer debonding using mid-wavelength infrared radiation ablation |
Bing Dang, John U. Knickerbocker |
2019-05-21 |
$2,520,000 |
| 10224229 |
Double layer release temporary bond and debond processes and systems |
Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker |
2019-03-05 |
$2,050,000 |
| 10177116 |
Large channel interconnects with through silicon vias (TSVs) and method for constructing the same |
Paul S. Andry, Mark D. Schultz |
2019-01-08 |
$2,287,000 |
| 10103450 |
Integration of area efficient antennas for phased array or wafer scale array antenna applications |
Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce |
2018-10-16 |
$2,674,000 |
| 10056337 |
Thin 3D die with electromagnetic radiation blocking encapsulation |
Paul S. Andry, Adam Toner |
2018-08-21 |
$2,787,000 |
| 9941250 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong |
2018-04-10 |
$2,135,000 |
| 9897627 |
Test probe substrate |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski |
2018-02-20 |
$3,618,000 |
| 9851379 |
Test probe substrate |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski |
2017-12-26 |
$2,704,000 |
| 9795964 |
Direct bond transfer layers for manufacturable sealing of microfluidic chips |
Joshua T. Smith, Chao Wang, Benjamin H. Wunsch |
2017-10-24 |
$3,030,000 |
| 9748131 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2017-08-29 |
$2,195,000 |
| 9648782 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong |
2017-05-09 |
$2,584,000 |
| 9636782 |
Wafer debonding using mid-wavelength infrared radiation ablation |
Bing Dang, John U. Knickerbocker |
2017-05-02 |
$3,833,000 |
| 9606142 |
Test probe substrate |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski |
2017-03-28 |
$2,520,000 |
| 9601364 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2017-03-21 |
$2,195,000 |
| 9586291 |
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release |
Bing Dang, John U. Knickerbocker, Eric P. Lewandowski |
2017-03-07 |
$9,679,000 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more |
2016-10-18 |
$1,445,000 |
| 9472859 |
Integration of area efficient antennas for phased array or wafer scale array antenna applications |
Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce |
2016-10-18 |
$1,445,000 |
| 9362223 |
Integrated circuit assembly with cushion polymer layer |
Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Melvin P. Zussman |
2016-06-07 |
$4,256,000 |
| 9355936 |
Flattened substrate surface for substrate bonding |
Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence +2 more |
2016-05-31 |
$2,120,000 |
| 9331141 |
CMOS structure on replacement substrate |
Paul S. Andry, Edmund J. Sprogis |
2016-05-03 |
$2,239,000 |
