Issued Patents All Time
Showing 25 most recent of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2022-08-23 |
| 11127715 | Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same | Paul S. Andry, Mark D. Schultz | 2021-09-21 |
| 10625257 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2020-04-21 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-08-13 |
| 10347588 | Thin 3D die with electromagnetic radiation blocking encapsulation | Paul S. Andry, Adam Toner | 2019-07-09 |
| 10297479 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2019-05-21 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-03-05 |
| 10177116 | Large channel interconnects with through silicon vias (TSVs) and method for constructing the same | Paul S. Andry, Mark D. Schultz | 2019-01-08 |
| 10103450 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce | 2018-10-16 |
| 10056337 | Thin 3D die with electromagnetic radiation blocking encapsulation | Paul S. Andry, Adam Toner | 2018-08-21 |
| 9941250 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2018-04-10 |
| 9897627 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2018-02-20 |
| 9851379 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2017-12-26 |
| 9795964 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2017-10-24 |
| 9748131 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2017-08-29 |
| 9648782 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2017-05-09 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2017-05-02 |
| 9606142 | Test probe substrate | Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski | 2017-03-28 |
| 9601364 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2017-03-21 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | Bing Dang, John U. Knickerbocker, Eric P. Lewandowski | 2017-03-07 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more | 2016-10-18 |
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce | 2016-10-18 |
| 9362223 | Integrated circuit assembly with cushion polymer layer | Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Melvin P. Zussman | 2016-06-07 |
| 9355936 | Flattened substrate surface for substrate bonding | Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence +2 more | 2016-05-31 |
| 9331141 | CMOS structure on replacement substrate | Paul S. Andry, Edmund J. Sprogis | 2016-05-03 |