Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2016-04-26 |
| 9313921 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong | 2016-04-12 |
| 9269561 | Wafer debonding using long-wavelength infrared radiation ablation | Bing Dang, John U. Knickerbocker | 2016-02-23 |
| 9209128 | Integrated circuit assembly with cushion polymer layer | Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Melvin P. Zussman | 2015-12-08 |
| 9171749 | Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler wafer | Bing Dang, Sarah H. Knickerbocker, Douglas C. La Tulipe, Jr., Spyridon Skordas, Kevin R. Winstel | 2015-10-27 |
| 9159602 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, John U. Knickerbocker | 2015-10-13 |
| 8927087 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol | 2015-01-06 |
| 8917210 | Package structures to improve on-chip antenna performance | Bing Dang, Duixian Liu, Loïc Marnat, Atif Shamim | 2014-12-23 |
| 8806740 | Silicon chicklet pedestal | S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch | 2014-08-19 |
| 8778737 | Flattened substrate surface for substrate bonding | Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles F. Musante, BethAnn Rainey +2 more | 2014-07-15 |
| 8735251 | Through silicon via and method of fabricating same | Paul S. Andry, Edmund J. Sprogis | 2014-05-27 |
| 8679280 | Laser ablation of adhesive for integrated circuit fabrication | Bing Dang, Matthew J. Farinelli, John U. Knickerbocker, Aparna Prabhakar, Robert E. Trzcinski | 2014-03-25 |
| 8637937 | Through silicon via for use in integrated circuit chips | Paul S. Andry, Edmund J. Sprogis | 2014-01-28 |
| 8617689 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol | 2013-12-31 |
| 8595919 | Silicon chicklet pedestal | S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch | 2013-12-03 |
| 8592932 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, John U. Knickerbocker | 2013-11-26 |
| 8564113 | Electrostatic chucking of an insulator handle substrate | Paul S. Andry, Edward C. Cooney, III, Edmund J. Sprogis, Anthony K. Stamper | 2013-10-22 |
| 8487425 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Emily R. Kinser +1 more | 2013-07-16 |
| 8440544 | CMOS structure and method of manufacture | Paul S. Andry, Edmund J. Sprogis | 2013-05-14 |
| 8419895 | Laser ablation for integrated circuit fabrication | Bing Dang, John U. Knickerbocker, Aparna Prabhakar, Peter J. Sorce, Robert E. Trzcinski | 2013-04-16 |
| 8388782 | Handler attachment for integrated circuit fabrication | Paul S. Andry, Bing Dang, John U. Knickerbocker, Aparna Prahbakar, Peter J. Sorce +1 more | 2013-03-05 |
| 8354737 | Small area, robust silicon via structure and process | Paul S. Andry, John M. Cotte, John U. Knickerbocker | 2013-01-15 |
| 8298917 | Process for wet singulation using a dicing singulation structure | Paul S. Andry, Timothy H. Daubenspeck, Jeffrey P. Gambino, Edmund J. Sprogis | 2012-10-30 |
| 8263497 | High-yield method of exposing and contacting through-silicon vias | Paul S. Andry, John M. Cotte, Michael F. Lofaro, Edmund J. Sprogis, James A. Tornello | 2012-09-11 |
| 8241995 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric | Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol | 2012-08-14 |