Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10358524 | Radiation curable resin composition and rapid three dimensional imaging process using the same | Paulus Antonius Maria Steeman, Beert Jacobs Keestra, Marco Marcus Matheus Driessen, Debra Lynn Fish Repko | 2019-07-23 |
| 9676899 | Radiation curable resin composition and rapid three dimensional imaging process using the same | Paulus Antonius Maria Steeman, Beert Jacobus Keestra, Marco Marcus Matheus Driessen, Debra Lynn Fish Repko | 2017-06-13 |
| 9362223 | Integrated circuit assembly with cushion polymer layer | Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang | 2016-06-07 |
| 9209128 | Integrated circuit assembly with cushion polymer layer | Paul S. Andry, Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang | 2015-12-08 |
| 6348245 | Polymide photo alignment film from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays | Brian C. Auman, Bernd Fiebranz, Edgar Bohm | 2002-02-19 |
| 6139926 | Polyimide photo alignment film from 3,3,4,4-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays | Brian C. Auman, Bernd Fiebranz, Edgar Bohm | 2000-10-31 |
| 6067139 | Multi-domain STN LCD comprising fluorinated polyimide alignment layers | Edgar Bohm, Akio Osabe, Brian C. Auman | 2000-05-23 |
| 5520845 | Poly(2,6-piperazinedione) alignment layer for liquid crystal displays | Brian C. Auman, Edgar Bohm | 1996-05-28 |
| 5314742 | Resin impregnated laminate for wiring board applications | Birol Kirayoglu, William J. Sillivan | 1994-05-24 |
| 4711822 | Metal core printed circuit boards | Wolfgang J. Choyke, Susan M. Wood, Luciano C. Scala, Leslie A. Doggrell, Janet S. Lauer | 1987-12-08 |
| 4601944 | Polybutadiene-epoxy-anhydride laminating resins | — | 1986-07-22 |