Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8242591 | Electrostatic chucking of an insulator handle substrate | Paul S. Andry, Edward C. Cooney, III, Edmund J. Sprogis, Anthony K. Stamper | 2012-08-14 |
| 8198734 | Silicon-on-insulator structures for through via in silicon carriers | Brent A. Anderson, Paul S. Andry, Edmund J. Sprogis | 2012-06-12 |
| 8138036 | Through silicon via and method of fabricating same | Paul S. Andry, Edmund J. Sprogis | 2012-03-20 |
| 8080876 | Structure and method for creating reliable deep via connections in a silicon carrier | Paul S. Andry, John U. Knickerbocker, Michelle L. Steen | 2011-12-20 |
| 8012796 | Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers | Paul S. Andry, John M. Cotte, John U. Knickerbocker | 2011-09-06 |
| 7987591 | Method of forming silicon chicklet pedestal | S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch | 2011-08-02 |
| 7902069 | Small area, robust silicon via structure and process | Paul S. Andry, John M. Cotte, John U. Knickerbocker | 2011-03-08 |
| 7820521 | Conductive through via structure and process for electronic device carriers | Paul S. Andry, Chirag S. Patel, Edmund J. Sprogis | 2010-10-26 |
| 7808798 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2010-10-05 |
| 7799613 | Integrated module for data processing system | Bing Dang, John U. Knickerbocker | 2010-09-21 |
| 7791168 | Techniques for providing decoupling capacitance | Raymond R. Horton, John U. Knickerbocker, Edmund J. Sprogis | 2010-09-07 |
| 7786596 | Hermetic seal and reliable bonding structures for 3D applications | Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Matthew R. Wordeman +1 more | 2010-08-31 |
| 7750459 | Integrated module for data processing system | Bing Dang, John U. Knickerbocker | 2010-07-06 |
| 7741722 | Through-wafer vias | Paul S. Andry, Edmund J. Sprogis, Kenneth J. Stein, Timothy D. Sullivan, Ping-Chuan Wang +1 more | 2010-06-22 |
| 7741226 | Optimal tungsten through wafer via and process of fabricating same | Paul S. Andry, Edward C. Cooney, III, Peter J. Lindgren, Dorreen Jane Ossenkop | 2010-06-22 |
| 7741231 | Techniques for providing decoupling capacitance | Raymond R. Horton, John U. Knickerbocker, Edmund J. Sprogis | 2010-06-22 |
| 7691669 | Techniques for providing decoupling capacitance | Raymond R. Horton, John U. Knickerbocker, Edmund J. Sprogis | 2010-04-06 |
| 7683478 | Hermetic seal and reliable bonding structures for 3D applications | Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Matthew R. Wordeman +1 more | 2010-03-23 |
| 7678696 | Method of making through wafer vias | Paul S. Andry, Edmund J. Sprogis | 2010-03-16 |
| 7645701 | Silicon-on-insulator structures for through via in silicon carriers | Brent A. Anderson, Paul S. Andry, Edmund J. Sprogis | 2010-01-12 |
| 7615405 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Leena Paivikki Buchwalter, Raymond R. Horton, John U. Knickerbocker, Steven L. Wright | 2009-11-10 |
| 7518229 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2009-04-14 |
| 7488624 | Techniques for providing decoupling capacitance | Raymond R. Horton, John U. Knickerbocker, Edmund J. Sprogis | 2009-02-10 |
| 7488680 | Conductive through via process for electronic device carriers | Paul S. Andry, Chirag S. Patel, Edmund J. Sprogis | 2009-02-10 |
| 7435627 | Techniques for providing decoupling capacitance | Raymond R. Horton, John U. Knickerbocker, Edmund J. Sprogis | 2008-10-14 |