Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418103 | Antenna package structure | Han-Wen Hu, Yi-Chieh TSAI, Yu-Jiu Wang, LI HAN CHANG | 2025-09-16 |
| 11621241 | Bonding element and method for manufacturing the same | Han-Wen Hu, Demin Liu, Yi-Chieh TSAI | 2023-04-04 |
| 9984993 | Bonding structure for semiconductor package and method of manufacturing the same | Min Shu, Yi-Hsiu Tseng, Shu-Chiao Kuo | 2018-05-29 |
| 9931813 | Bonding structure and method of fabricating the same | Wei-Chung Lo, Cheng-Ta Ko | 2018-04-03 |
| 9496238 | Sloped bonding structure for semiconductor package | Min Shu, Yi-Hsiu Tseng, Shu-Chiao Kuo | 2016-11-15 |
| 9373564 | Semiconductor device, manufacturing method and stacking structure thereof | Wen-Wei Shen, Cheng-Ta Ko | 2016-06-21 |
| 9196595 | Semiconductor bonding structure | Kuo-Hua Chen, Tzu-Hua Lin, Yan Huang | 2015-11-24 |
| 8951837 | Submicron connection layer and method for using the same to connect wafers | Yao-Jen Chang | 2015-02-10 |
| 8927087 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2015-01-06 |
| 8900918 | Graphene channel-based devices and methods for fabrication thereof | Phaedon Avouris, Damon B. Farmer, Yu-Ming Lin | 2014-12-02 |
| 8878193 | Graphene channel-based devices and methods for fabrication thereof | Phaedon Avouris, Damon B. Farmer, Yu-Ming Lin | 2014-11-04 |
| 8766734 | Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same | Chi-Chung Chang, Chih-Hung Chiu, Yen-Chi Chen, JIAN-YU SHIH | 2014-07-01 |
| 8698165 | Graphene channel-based devices and methods for fabrication thereof | Phaedon Avouris, Damon B. Farmer, Yu-Ming Lin | 2014-04-15 |
| 8679891 | Heterostructure containing IC and LED and method for fabricating the same | Cheng-Ta Ko, Wei-Chung Lo | 2014-03-25 |
| 8653641 | Integrated circuit device | Ming-Fang Lai, Hung-Ming Chen | 2014-02-18 |
| 8617689 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2013-12-31 |
| 8603862 | Precise-aligned lock-and-key bonding structures | Fei Liu | 2013-12-10 |
| 8546952 | Electrical test structure applying 3D-ICS bonding technology for stacking error measurement | Shih-Wei Li | 2013-10-01 |
| 8536613 | Heterostructure containing IC and LED and method for fabricating the same | Cheng-Ta Ko, Wei-Chung Lo | 2013-09-17 |
| 8525144 | Programmable via devices | Sampath Purushothaman | 2013-09-03 |
| 8508041 | Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof | Sheng-Yao Hsu | 2013-08-13 |
| 8455297 | Method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology | Phaedon Avouris, Yu-Ming Lin | 2013-06-04 |
| 8445320 | Graphene channel-based devices and methods for fabrication thereof | Phaedon Avouris, Damon B. Farmer, Yu-Ming Lin | 2013-05-21 |
| 8426921 | Three-dimensional integrated circuits and techniques for fabrication thereof | Solomon Assefa, Steven J. Koester, Yuri A. Vlasov | 2013-04-23 |
| 8405279 | Coupling piezoelectric material generated stresses to devices formed in integrated circuits | Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martyna, Xiao Hu Liu, Dennis M. Newns | 2013-03-26 |