Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148678 | Semiconductor package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang | 2024-11-19 |
| 12080681 | Package structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou | 2024-09-03 |
| 11502015 | Semiconductor package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang | 2022-11-15 |
| 11424219 | Package structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou | 2022-08-23 |
| 9773755 | Substrate interconnections having different sizes | Ying-Ching Shih, Chen-Shien Chen, Ming-Fa Chen | 2017-09-26 |
| 9768138 | Improving the strength of micro-bump joints | Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2017-09-19 |
| 9373564 | Semiconductor device, manufacturing method and stacking structure thereof | Kuan-Neng Chen, Cheng-Ta Ko | 2016-06-21 |
| 9219046 | Strength of micro-bump joints | Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2015-12-22 |
| 9142533 | Substrate interconnections having different sizes | Ying-Ching Shih, Chen-Shien Chen, Ming-Fa Chen | 2015-09-22 |
| 8901736 | Strength of micro-bump joints | Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2014-12-02 |
| 8653648 | Zigzag pattern for TSV copper adhesion | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2014-02-18 |
| 8241963 | Recessed pillar structure | Yao-Chun Chuang, Chen-Shien Chen, Ming-Fa Chen | 2012-08-14 |
| 8202800 | Method of forming through silicon via with dummy structure | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2012-06-19 |
| 8178970 | Strong interconnection post geometry | Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen, Ching-Wen Hsiao | 2012-05-15 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2011-06-28 |