Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Chin-Fu Kao, Tsung-Yang Hsieh, Jyun-Lin Wu | 2025-09-23 |
| 12388047 | Integrated fan-out platform and manufacturing method for semiconductor devices | Li-Hsien Huang, Hsueh-Lung Cheng, Yinlung Lu | 2025-08-12 |
| 12382587 | Methods and systems for improving surface mount joinder | Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yinlung Lu | 2025-08-05 |
| 12362307 | Semiconductor package with ball grid array connection having improved reliability | Yu-Sheng Lin, Chen-Nan Chiu, Jyun-Lin Wu | 2025-07-15 |
| 12362246 | Interposer including stepped surfaces and methods of forming the same | Yu-Sheng Lin, Hsin-Hsien Lee, Jyun-Lin Wu | 2025-07-15 |
| 12354946 | Delamination control of dielectric layers of integrated circuit chips | Jun He, Li-Hsien Huang, Chih-Lin Wang, Shih-Kang Tien | 2025-07-08 |
| 12354975 | Guard ring structure | Min-Feng Ku, Cheng-Chien Li, Ching-Pin Lin | 2025-07-08 |
| 12334465 | Semiconductor package and method of forming same | Li-Hsien Huang, SyuFong Li, Ching-Pin Lin, Jun He | 2025-06-17 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo +2 more | 2025-06-03 |
| 12288735 | Through via structure | Min-Feng Ku, Cheng-Chien Li, Ching-Pin Lin | 2025-04-29 |
| 12113055 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2024-10-08 |
| 12107041 | Metal plate corner structure on metal insulator metal | Yuan-Yang Hsiao, Hsiang-Ku Shen, Dian-Hau Chen, Hsiao Ching-Wen | 2024-10-01 |
| 12068300 | Chip-on-wafer-on-substrate package with improved yield | Chia-Wei Chang, Ju-Min Chen, Jyun-Lin Wu | 2024-08-20 |
| 12046566 | Devices with through silicon vias, guard rings and methods of making the same | Min-Feng Ku, Ching-Pin Lin, Cheng-Chien Li | 2024-07-23 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yu-Tse Su, Chen-Shien Chen | 2024-07-16 |
| 11984422 | Semiconductor package and method of forming same | Li-Hsien Huang, SyuFong Li, Ching-Pin Lin, Jun He | 2024-05-14 |
| 11855025 | Semiconductor device and package assembly including the same | Chita Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2023-12-26 |
| 11728262 | Metal plate corner structure on metal insulator metal | Yuan-Yang Hsiao, Hsiang-Ku Shen, Dian-Hau Chen, Hsiao Ching-Wen | 2023-08-15 |
| 11342291 | Semiconductor packages with crack preventing structure | Hong-Seng Shue, Chen-Nan Chiu, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu | 2022-04-26 |
| 11258461 | Data processing device and method | Hsin-Yun Hu, Ching-Yen Lee, Ming-Jhe Du | 2022-02-22 |
| 11244940 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2021-08-10 |
| 10867810 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-12-15 |
| 10784223 | Elongated bump structures in package structure | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng | 2020-09-22 |