Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362307 | Semiconductor package with ball grid array connection having improved reliability | Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang | 2025-07-15 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Hong-Seng Shue, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |