Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142582 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Ming-Da Cheng +1 more | 2024-11-12 |
| 12087648 | Seal ring structure with zigzag patterns and method forming same | Kuan-Hung Chen, Po-Hao Tsai, Mirng-Ji Lii | 2024-09-10 |
| 12057423 | Bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Ming-Da Cheng | 2024-08-06 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Yu-Tse Su, Chen-Shien Chen | 2024-07-16 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Yu-Tse Su | 2024-02-20 |
| 11854913 | Method for detecting defects in semiconductor device | Yang-Che Chen, Wei-Yu Chou, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2023-12-26 |
| 11855022 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Dian-Hau Chen +1 more | 2023-12-26 |
| 11848270 | Chip structure and method for forming the same | Sheng-Han Tsai, Kuo-Chin Chang, Mirng-Ji Lii, Kuo-Ching Hsu | 2023-12-19 |
| 11769741 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Ching-Wen Hsiao +1 more | 2023-09-26 |
| 11380639 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Dian-Hau Chen +1 more | 2022-07-05 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Chen-Nan Chiu, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |
| 11088037 | Semiconductor device having probe pads and seal ring | Yang-Che Chen, Wei-Yu Chou, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2021-08-10 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Cheng-Jen Lin, Wen-Hsiung Lu, Ming-Da Cheng +4 more | 2021-07-27 |
| 11011462 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Chun-Yi Yang, Chih-Hao Lin, Ruei-Hung Jang | 2021-05-18 |
| 10861810 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Dian-Hau Chen +1 more | 2020-12-08 |
| 10049941 | Semiconductor isolation structure with air gaps in deep trenches | Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu | 2018-08-14 |
| 9614031 | Methods for forming a high-voltage super junction by trench and epitaxial doping | Tai-I Yang, Shou-Wei Lee, Shao-Chi Yu, Kun-Ming Huang, Po-Tao Chu | 2017-04-04 |
| 9558986 | Semiconductor structure and manufacturing method thereof | Tai-I Yang, Kun-Ming Huang, Chih-Heng Shen, Po-Tao Chu | 2017-01-31 |
| 9496221 | Method for forming fuse pad and bond pad of integrated circuit | Tai-I Yang, Marcus Yang, Chih-Hao Lin, Ruei-Hung Jang | 2016-11-15 |
| 9269609 | Semiconductor isolation structure with air gaps in deep trenches | Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu | 2016-02-23 |
| 9096428 | Methods and apparatus for MEMS structure release | Tai-I Yang, Ming-Tai Chung, Ming-Yi Lin | 2015-08-04 |
| 9093520 | High-voltage super junction by trench and epitaxial doping | Tai-I Yang, Shou-Wei Lee, Shao-Chi Yu, Kun-Ming Huang, Po-Tao Chu | 2015-07-28 |
| 8975153 | Super junction trench metal oxide semiconductor device and method of making the same | Tai-I Yang, Kun-Ming Huang, Tzu-Cheng Chen, Ming-Che Yang, Po-Tao Chu | 2015-03-10 |
| 8953155 | Optical inspection system and optical inspection method | Tai-I Yang, Ming-Tai Chung | 2015-02-10 |