Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230595 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Chin Wei Kang, Yu-Feng Chen +1 more | 2025-02-18 |
| 12136644 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Yung-Ching Chao, Ming-Da Cheng, Mirng-Ji Lii | 2024-11-05 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Chin Wei Kang +1 more | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Ming-Da Cheng +1 more | 2024-03-26 |
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Ting-Li Yang, Kai-Di Wu, Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang | 2023-12-26 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2023-08-29 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Chin Wei Kang +1 more | 2023-01-31 |
| 11532692 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Yung-Ching Chao, Ming-Da Cheng, Mirng-Ji Lii | 2022-12-20 |
| 11413576 | Method for treating gas | — | 2022-08-16 |
| 11171085 | Semiconductor device structure with magnetic layer and method for forming the same | Hon-Lin Huang, Wei-Li Huang, Chun-Kai Tzeng, Chin-Yu Ku | 2021-11-09 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11114879 | Smart charging method | — | 2021-09-07 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wen-Hsiung Lu, Ming-Da Cheng +1 more | 2021-08-24 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin +2 more | 2021-08-17 |
| 11075173 | Semiconductor device and method of forming same | Chih-Hsiang Tseng, Yu-Feng Chen, Wen-Hsiung Lu, Ming-Da Cheng, Kuo-Ching Hsu +4 more | 2021-07-27 |
| 11024593 | Metal bumps and method forming same | Ming-Da Cheng, Yung-Ching Chao, Chun-Kai Tzeng, Chin Wei Kang, Yu-Feng Chen +1 more | 2021-06-01 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2021-05-11 |
| 10910466 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Yung-Ching Chao, Ming-Da Cheng, Mirng-Ji Lii | 2021-02-02 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan | 2020-05-12 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan | 2019-05-07 |
| 7006988 | Method of collaboration commerce | Hsiu-Chu Wu | 2006-02-28 |
| 6108198 | Modular computer device | — | 2000-08-22 |