Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2025-09-09 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng | 2025-08-05 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2024-06-18 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2024-05-21 |
| 11978720 | Semiconductor device package and methods of manufacture | Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |
| 11961817 | Apparatus and method for forming a package structure | Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2024-04-16 |
| 11942445 | Semiconductor device with conductive pad | Chen-En Yen, Chin Wei Kang, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2024-03-26 |
| 11909368 | Dual mode notch filter | Chinmaya Mishra | 2024-02-20 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Wei-Hung Lin, Wan-Yu Chiang | 2024-01-30 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2023-08-29 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang | 2021-10-19 |
| 11101233 | Semiconductor device and method for forming the same | Chen-En Yen, Chin Wei Kang, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng +1 more | 2021-08-24 |
| 11004685 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |
| 10651142 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang | 2020-05-12 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-Shien Chen, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang | 2019-05-07 |