Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2025-09-09 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang, Ming-Da Cheng | 2025-08-05 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2025-04-29 |
| 12237320 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2025-02-25 |
| 12094792 | Package structure having lid with protrusion and manufacturing method thereof | Kuan-Min Wang, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang | 2024-09-17 |
| 12068303 | Package structure | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2024-08-20 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2024-06-18 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11961944 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2024-04-16 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2024-04-16 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |
| 11855058 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-26 |
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Hui-Min Huang, Po-Hao Tsai, Yung-Sheng Lin | 2023-12-26 |
| 11742204 | Multi-layer structures and methods of forming | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2023-08-29 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2023-01-31 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Hui-Min Huang, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Kuan-Liang Lai | 2021-11-09 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chin Wei Kang, Hui-Min Huang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 11004685 | Multi-layer structures and methods of forming | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2021-05-11 |