Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2025-04-29 |
| 12218077 | Semiconductor device package | Ming-Chiang Lee, Yung-I Yeh | 2025-02-04 |
| 12119312 | Device package | Wei-Tung CHANG, Jen-Chieh Kao, Huei-Shyong Cho | 2024-10-15 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11705412 | Device package | Wei-Tung CHANG, Jen-Chieh Kao, Huei-Shyong Cho | 2023-07-18 |
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Chien-Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii | 2022-09-20 |
| 11329017 | Semiconductor device package and method of manufacturing the same | Wei-Tung CHANG | 2022-05-10 |
| 11316274 | Semiconductor device package and method of manufacturing the same | Hsu-Nan FANG | 2022-04-26 |
| 11158685 | Organic light-emitting diode touch display operating method | Chen Yang | 2021-10-26 |
| 11152315 | Electronic device package and method for manufacturing the same | Wei-Tung CHANG | 2021-10-19 |
| 11037891 | Device package | Wei-Tung CHANG, Jen-Chieh Kao, Huei-Shyong Cho | 2021-06-15 |
| 10950530 | Semiconductor device package and method of manufacturing the same | Jen-Chieh Kao | 2021-03-16 |
| 10784208 | Semiconductor package device and method of manufacturing the same | Kuo-Hsien Liao, Chieh-Chen Fu | 2020-09-22 |
| 10431554 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Chieh-Chen Fu, Kuo-Hsien Liao | 2019-10-01 |
| 10163400 | Display driving apparatus | Huang-Ren Chen, Shao-Ping Hung | 2018-12-25 |
| 9871005 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Chieh-Chen Fu, Kuo-Hsien Liao | 2018-01-16 |
| 9653407 | Semiconductor device packages | Shih-Ren Chen | 2017-05-16 |
| 9640476 | Driving circuit and pin output order arranging method | Shin-Tai Lo, Shao-Ping Hung | 2017-05-02 |
| 9269673 | Semiconductor device packages | I-Chia Lin, Chieh-Chen Fu, Kuo-Hsien Liao | 2016-02-23 |
| 9190367 | Semiconductor package structure and semiconductor process | Kuo-Hsien Liao, Ming-Chiang Lee | 2015-11-17 |
| 9054239 | Process of forming a grid electrode on the front-side of a silicon wafer | Russell David Anderson, Kenneth Warren Hang, Shih-Ming Kao, Giovanna Laudisio, Chun-Kwei Wu | 2015-06-09 |
| 8486826 | Process of forming a grid electrode on the front-side of a silicon wafer | Russell David Anderson, Kenneth Warren Hang, Shih-Ming Kao, Giovanna Laudisio, Chun-Kwei Wu | 2013-07-16 |
| 8372679 | Process of forming a grid electrode on the front-side of a silicon wafer | David K. Anderson, Russell David Anderson, Kenneth Warren Hang, Shih-Ming Kao, Giovanna Laudisio +1 more | 2013-02-12 |
| 7385311 | Voltage controller implemented in a low operation voltage device | — | 2008-06-10 |
| 6656753 | Method and structure for measuring bridge induced by mask layout amendment | — | 2003-12-02 |