Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266644 | Semiconductor package device method of manufacturing the same | Chang-Yu Lin, Chi-Han Chen | 2025-04-01 |
| 11474301 | Device for communication | Chang-Feng You, Jr-Wei LIN, Kao-Ming Su, Chen Yuan Weng | 2022-10-18 |
| 11329016 | Semiconductor device package and method of manufacturing the same | Meng-Wei Hsieh | 2022-05-10 |
| 10930627 | Semiconductor package device and method of manufacturing the same | Chang-Yu Lin, Chi-Han Chen | 2021-02-23 |
| 10784208 | Semiconductor package device and method of manufacturing the same | Kuo-Hsien Liao, Cheng-Nan Lin | 2020-09-22 |
| 10431554 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Kuo-Hsien Liao, Cheng-Nan Lin | 2019-10-01 |
| 9871005 | Semiconductor device package and method of manufacturing the same | I-Chia Lin, Kuo-Hsien Liao, Cheng-Nan Lin | 2018-01-16 |
| 9269673 | Semiconductor device packages | I-Chia Lin, Kuo-Hsien Liao, Cheng-Nan Lin | 2016-02-23 |
| 8963316 | Semiconductor device and method for manufacturing the same | Chih-Jing Hsu, Ying-Te Ou, Che-Hau Huang | 2015-02-24 |
| 8120148 | Package structure with embedded die and method of fabricating the same | Kuo-Hua Chen, Ying-Te Ou | 2012-02-21 |