Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277917 | Embedded component package structure, embedded type panel substrate and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen, Chien-Hao Wang | 2022-03-15 |
| 10431554 | Semiconductor device package and method of manufacturing the same | Chieh-Chen Fu, Kuo-Hsien Liao, Cheng-Nan Lin | 2019-10-01 |
| 9871005 | Semiconductor device package and method of manufacturing the same | Chieh-Chen Fu, Kuo-Hsien Liao, Cheng-Nan Lin | 2018-01-16 |
| 9269673 | Semiconductor device packages | Chieh-Chen Fu, Kuo-Hsien Liao, Cheng-Nan Lin | 2016-02-23 |
| 9153542 | Semiconductor package having an antenna and manufacturing method thereof | Sheng-Jian Jou, Han-Chee Yen | 2015-10-06 |
| 8704341 | Semiconductor packages with thermal dissipation structures and EMI shielding | Yu-Chou Tseng, Jin-Feng Yang, Chi-Sheng Chung, Kuo-Hsien Liao | 2014-04-22 |
| 7036649 | Auto-bill-dispensing machine | Ya-Hui Yang | 2006-05-02 |