Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704341 | Semiconductor packages with thermal dissipation structures and EMI shielding | I-Chia Lin, Jin-Feng Yang, Chi-Sheng Chung, Kuo-Hsien Liao | 2014-04-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704341 | Semiconductor packages with thermal dissipation structures and EMI shielding | I-Chia Lin, Jin-Feng Yang, Chi-Sheng Chung, Kuo-Hsien Liao | 2014-04-22 |