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Semiconductor device package |
Chanyuan Liu, Yu-Hsiang Sun |
2024-06-11 |
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Chanyuan Liu, Alex Chi Keung Chan, Fuh-Yuh Shih |
2023-12-05 |
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Chanyuan Liu, Han-Chee Yen, Alex Chi Keung Chan, Christophe Zinck |
2022-02-01 |
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Alex Chi Keung Chan |
2021-02-02 |
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Semiconductor package device and method of manufacturing the same |
Cheng-Nan Lin, Chieh-Chen Fu |
2020-09-22 |
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Semiconductor device package and method of manufacturing the same |
I-Chia Lin, Chieh-Chen Fu, Cheng-Nan Lin |
2019-10-01 |
| 9984983 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods |
Chi-Sheng Chung, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh |
2018-05-29 |
| 9871005 |
Semiconductor device package and method of manufacturing the same |
I-Chia Lin, Chieh-Chen Fu, Cheng-Nan Lin |
2018-01-16 |
| 9484313 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods |
Chi-Sheng Chung, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh |
2016-11-01 |
| 9269673 |
Semiconductor device packages |
I-Chia Lin, Chieh-Chen Fu, Cheng-Nan Lin |
2016-02-23 |
| 9190367 |
Semiconductor package structure and semiconductor process |
Ming-Chiang Lee, Cheng-Nan Lin |
2015-11-17 |
| 9070793 |
Semiconductor device packages having electromagnetic interference shielding and related methods |
Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng, Yu-Hsiang Sun |
2015-06-30 |
| 9007273 |
Semiconductor package integrated with conformal shield and antenna |
Chi-Hong Chan, Shih Fuyu |
2015-04-14 |
| 8786060 |
Semiconductor package integrated with conformal shield and antenna |
Han-Chee Yen, Chi-Sheng Chung, Yung-I Yeh |
2014-07-22 |
| 8704341 |
Semiconductor packages with thermal dissipation structures and EMI shielding |
I-Chia Lin, Yu-Chou Tseng, Jin-Feng Yang, Chi-Sheng Chung |
2014-04-22 |
| 8653633 |
Semiconductor device packages with electromagnetic interference shielding |
Chi-Tsung Chiu, Chih-Pin Hung |
2014-02-18 |
| 8378466 |
Wafer-level semiconductor device packages with electromagnetic interference shielding |
Chi-Tsung Chiu, Wei Chi Yih, Yu-Chi Chen, Chen-Chuan Fan |
2013-02-19 |
| 8247889 |
Package having an inner shield and method for making the same |
Jian-Cheng Chen |
2012-08-21 |
| 8212339 |
Semiconductor device packages with electromagnetic interference shielding |
Jian-Cheng Chen, Chen-Chuan Fan, Chi-Tsung Chiu, Chih-Pin Hung |
2012-07-03 |
| 8212340 |
Chip package and manufacturing method thereof |
— |
2012-07-03 |
| 8144479 |
Wireless communication module |
Kuan-Hsing Li |
2012-03-27 |
| 8039930 |
Package structure for wireless communication module |
Dian Li |
2011-10-18 |
| 7989928 |
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Chi-Tsung Chiu, Chih-Pin Hung |
2011-08-02 |
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Metallic cover of miniaturization module |
Kuan-Hsing Li |
2010-08-31 |
| 7312518 |
Miniaturized multi-chip module and method for manufacturing the same |
Jia-Yang Chen, Chuei-Tang Wang |
2007-12-25 |