Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Yung-I Yeh | 2018-05-29 |
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Yung-I Yeh | 2016-11-01 |