Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh | 2018-05-29 |
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai, Yung-I Yeh | 2016-11-01 |
| 8786060 | Semiconductor package integrated with conformal shield and antenna | Han-Chee Yen, Kuo-Hsien Liao, Yung-I Yeh | 2014-07-22 |
| 8704341 | Semiconductor packages with thermal dissipation structures and EMI shielding | I-Chia Lin, Yu-Chou Tseng, Jin-Feng Yang, Kuo-Hsien Liao | 2014-04-22 |