Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482482 | Substrate structures, methods for forming the same and semiconductor device structures comprising the same | Ian HU, Cheng-Yu Tsai, Hung-Hsien Huang | 2022-10-25 |
| 11075186 | Semiconductor package | Ian HU, Jia-Rung Ho, Chih-Pin Hung, Ping-Feng Yang | 2021-07-27 |
| 11024557 | Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die | Hsin-En Chen, Ian HU | 2021-06-01 |
| 10840219 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |
| 10770369 | Semiconductor device package | Chih-Pin Hung, Tang-Yuan Chen, Meng-Kai SHIH | 2020-09-08 |
| 10410942 | Semiconductor device package and method for manufacturing the same | Tsan-Hsien Chen, Ian HU, Shih-Wei Chen, Hui-Chen Hsu | 2019-09-10 |
| 10332862 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Chin-Li KAO, Meng-Kai SHIH | 2019-06-25 |
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Chen-Yin Tai, Yung-I Yeh | 2018-05-29 |
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Chen-Yin Tai, Yung-I Yeh | 2016-11-01 |
| 8704341 | Semiconductor packages with thermal dissipation structures and EMI shielding | I-Chia Lin, Yu-Chou Tseng, Chi-Sheng Chung, Kuo-Hsien Liao | 2014-04-22 |