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IH

Ian HU — 21 Patents

AEAdvanced Semiconductor Engineering: 21 patents #44 of 1,073Top 5%
Kaohsiung, TW: #174 of 2,441 inventorsTop 8%
Overall (All Time): #201,324 of 4,157,543Top 5%
21 Patents All Time
Ian HU has been granted 21 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2019 and the most recent in June 2025. Ian HU ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Ian HU in Kaohsiung, TW.

Patents per Year

Patents granted per year, 2019 to 2025Bar chart with a peak of 7 patents in 2021.peak 72019: 3 patents20192020: 1 patents20202021: 7 patents20212022: 6 patents20222024: 2 patents20242025: 2 patents2025

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12322672 Semiconductor package structure and semiconductor manufacturing process Cheng-Yu Tsai 2025-06-03
12300560 Semiconductor device package and method of manufacturing the same Ming-Han Wang 2025-05-13
12111114 Heat transfer element, method for forming the same and semiconductor structure comprising the same Hung-Hsien Huang, Shin-Luh TARNG, Chien-Neng Liao, Jui-Cheng Yu, Po-Cheng Huang 2024-10-08 $2,980,000
11901252 Semiconductor device package and method of manufacturing the same Ming-Han Wang 2024-02-13 $2,842,000
11482482 Substrate structures, methods for forming the same and semiconductor device structures comprising the same Jin-Feng Yang, Cheng-Yu Tsai, Hung-Hsien Huang 2022-10-25 $1,849,000
11410902 Semiconductor device package and method of manufacturing the same Ming-Han Wang 2022-08-09 $926,000
11410934 Substrate and semiconductor device package and method for manufacturing the same Shin-Luh TARNG 2022-08-09 $926,000
11375124 Optical measurement equipment and method for measuring warpage of a workpiece Ming-Han Wang, Meng-Kai SHIH, Hsuan-Yu Chen 2022-06-28 $1,974,000
11282767 Semiconductor package structure and electronic device Hsin-En Chen, Jung-Che Tsai 2022-03-22
11217502 Semiconductor device packages and methods of manufacturing the same Meng-Kai SHIH, Chih-Pin Hung 2022-01-04 $1,679,000
11152274 Multi-moldings fan-out package and process Wei-Hsuan Lee, Sung-Mao Li, Ming-Han Wang 2021-10-19 $2,754,000
11139222 Electronic device comprising heat pipe contacting a cover structure for heat dissipation Jung-Che Tsai, Chih-Pin Hung 2021-10-05 $907,000
11139226 Semiconductor package structure and assembly structure Hsin-En Chen, Hung-Hsien Huang 2021-10-05 $907,000
11081420 Substrate structure and semiconductor package structure Hsin-En Chen, Chih-Pin Hung 2021-08-03 $3,865,000
11075186 Semiconductor package Jia-Rung Ho, Jin-Feng Yang, Chih-Pin Hung, Ping-Feng Yang 2021-07-27 $5,401,000
11024557 Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die Hsin-En Chen, Jin-Feng Yang 2021-06-01 $2,470,000
10985085 Semiconductor device package and method for manufacturing the same Chih-Pin Hung, Meng-Kai SHIH 2021-04-20 $9,040,000
10861726 Apparatus and method for measuring warpage Chun Hung TSAI, Hsuan-Yu Chen, Meng-Kai SHIH, Shin-Luh TARNG 2020-12-08 $1,136,000
10522508 Semiconductor device package and a method of manufacturing the same Ming-Han Wang, Tsun-Lung Hsieh, Chih-Yi Huang, Chih-Pin Hung 2019-12-31 $1,815,000
10453802 Semiconductor package structure, semiconductor device and method for manufacturing the same — 2019-10-22 $1,818,000
10410942 Semiconductor device package and method for manufacturing the same Tsan-Hsien Chen, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu 2019-09-10 $1,647,000

Frequent Collaborators

Ming-Han Wang6 shared
Chih-Pin Hung6 shared
Jin-Feng Yang4 shared
Hsin-En Chen4 shared
Meng-Kai SHIH4 shared
Hung-Hsien Huang3 shared

Nearby-Ranked Inventors

Subhash Sankuratripati21
Brian Riordan21
Woongki Min21
Jeremy Cailleteau21
Shigeru Chiba21
Cecilia Carbonelli21
Pin-Wen Chen21
Michael Danz21
Paul Kolen21