Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322672 | Semiconductor package structure and semiconductor manufacturing process | Cheng-Yu Tsai | 2025-06-03 |
| 12300560 | Semiconductor device package and method of manufacturing the same | Ming-Han Wang | 2025-05-13 |
| 12111114 | Heat transfer element, method for forming the same and semiconductor structure comprising the same | Hung-Hsien Huang, Shin-Luh TARNG, Chien-Neng Liao, Jui-Cheng Yu, Po-Cheng Huang | 2024-10-08 |
| 11901252 | Semiconductor device package and method of manufacturing the same | Ming-Han Wang | 2024-02-13 |
| 11482482 | Substrate structures, methods for forming the same and semiconductor device structures comprising the same | Jin-Feng Yang, Cheng-Yu Tsai, Hung-Hsien Huang | 2022-10-25 |
| 11410902 | Semiconductor device package and method of manufacturing the same | Ming-Han Wang | 2022-08-09 |
| 11410934 | Substrate and semiconductor device package and method for manufacturing the same | Shin-Luh TARNG | 2022-08-09 |
| 11375124 | Optical measurement equipment and method for measuring warpage of a workpiece | Ming-Han Wang, Meng-Kai SHIH, Hsuan-Yu Chen | 2022-06-28 |
| 11282767 | Semiconductor package structure and electronic device | Hsin-En Chen, Jung-Che Tsai | 2022-03-22 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Meng-Kai SHIH, Chih-Pin Hung | 2022-01-04 |
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Sung-Mao Li, Ming-Han Wang | 2021-10-19 |
| 11139222 | Electronic device comprising heat pipe contacting a cover structure for heat dissipation | Jung-Che Tsai, Chih-Pin Hung | 2021-10-05 |
| 11139226 | Semiconductor package structure and assembly structure | Hsin-En Chen, Hung-Hsien Huang | 2021-10-05 |
| 11081420 | Substrate structure and semiconductor package structure | Hsin-En Chen, Chih-Pin Hung | 2021-08-03 |
| 11075186 | Semiconductor package | Jia-Rung Ho, Jin-Feng Yang, Chih-Pin Hung, Ping-Feng Yang | 2021-07-27 |
| 11024557 | Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die | Hsin-En Chen, Jin-Feng Yang | 2021-06-01 |
| 10985085 | Semiconductor device package and method for manufacturing the same | Chih-Pin Hung, Meng-Kai SHIH | 2021-04-20 |
| 10861726 | Apparatus and method for measuring warpage | Chun Hung TSAI, Hsuan-Yu Chen, Meng-Kai SHIH, Shin-Luh TARNG | 2020-12-08 |
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ming-Han Wang, Tsun-Lung Hsieh, Chih-Yi Huang, Chih-Pin Hung | 2019-12-31 |
| 10453802 | Semiconductor package structure, semiconductor device and method for manufacturing the same | — | 2019-10-22 |
| 10410942 | Semiconductor device package and method for manufacturing the same | Tsan-Hsien Chen, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu | 2019-09-10 |