Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111114 | Heat transfer element, method for forming the same and semiconductor structure comprising the same | Hung-Hsien Huang, Shin-Luh TARNG, Ian HU, Jui-Cheng Yu, Po-Cheng Huang | 2024-10-08 |
| 10612854 | Sample holder annealing apparatus using the same | Hsu-Shen Chu, Yao-Hsiang Chen | 2020-04-07 |
| 10475742 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Yu-Lun Chueh, Tsung-Cheng CHAN +1 more | 2019-11-12 |
| 10283450 | Method for forming semiconductor device structure having conductive structure with twin boundaries | Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Yu-Lun Chueh, Tsung-Cheng CHAN +1 more | 2019-05-07 |
| 9761523 | Interconnect structure with twin boundaries and method for forming the same | Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Yu-Lun Chueh, Tsung-Cheng CHAN +1 more | 2017-09-12 |
| 8420185 | Method for forming metal film with twins | Yu-Lun Chueh, Tsung-Cheng CHAN | 2013-04-16 |