Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394676 | Semiconductor package structure and method for manufacturing the same | Chen-Chao Wang, Keng-Tuan Chang | 2025-08-19 |
| 12216157 | Package structure and testing method | Chen-Chao Wang, Tsung-Tang Tsai | 2025-02-04 |
| 11901245 | Semiconductor package structure and method for manufacturing the same | Chen-Chao Wang, Keng-Tuan Chang | 2024-02-13 |
| 11855034 | Electronic device package and method of manufacturing the same | Chung-Hung LAI, Chin-Li KAO, Teck-Chong Lee | 2023-12-26 |
| 11733294 | Package structure and testing method | Chen-Chao Wang, Tsung-Tang Tsai | 2023-08-22 |
| 11714215 | Optical lens, mold for optical lens and manufacturing method thereof | Chun-Chieh Chen, Chia-Jung Chang, Chun-Yi Yeh | 2023-08-01 |
| 11699654 | Electronic device package and method of manufacturing the same | Shao-An Chen, Ping Shen | 2023-07-11 |
| 11621220 | Assembly structure and method for manufacturing the same | Yung-Shun Chang, Chih-Pin Hung, Teck-Chong Lee | 2023-04-04 |
| 11515249 | Wiring package and method of manufacturing the same | Chen-Chao Wang, Mi-Chun Hung | 2022-11-29 |
| 11424167 | Semiconductor package structure and method for manufacturing the same | Chen-Chao Wang, Keng-Tuan Chang | 2022-08-23 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2021-01-05 |
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ian HU, Ming-Han Wang, Tsun-Lung Hsieh, Chih-Pin Hung | 2019-12-31 |
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Fu-Chen Chu | 2019-06-25 |
| 10074622 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Fu-Chen Chu | 2018-09-11 |
| 9564393 | Semiconductor device package and method of making the same | Kuo-Hua Chen, Chi-Tsung Chiu | 2017-02-07 |
| 8389394 | Method of making semiconductor package having redistribution layer | Hung-Hsiang Cheng | 2013-03-05 |
| 8193454 | Circuit substrate having power/ground plane with grid holes | Hung-Hsiang Cheng | 2012-06-05 |
| 7977784 | Semiconductor package having redistribution layer | Hung-Hsiang Cheng | 2011-07-12 |
| 7851895 | Semiconductor structure and semiconductor manufacturing method | Chih-Wei Wu | 2010-12-14 |
| 7838777 | Signal transmission structure, package structure and bonding method thereof | Chia-Hsing Chou | 2010-11-23 |