| 12394676 |
Semiconductor package structure and method for manufacturing the same |
Chih-Yi Huang, Keng-Tuan Chang |
2025-08-19 |
|
| 12216157 |
Package structure and testing method |
Tsung-Tang Tsai, Chih-Yi Huang |
2025-02-04 |
|
| 12176305 |
Semiconductor package with integrated voltage regulator device and separate bridge die |
Pao-Nan Lee, Chang-Chi Lee |
2024-12-24 |
$1,732,000 |
| 12132006 |
Semiconductor package structure |
Pao-Nan Lee, Chang-Chi Lee |
2024-10-29 |
$3,037,000 |
| 11901245 |
Semiconductor package structure and method for manufacturing the same |
Chih-Yi Huang, Keng-Tuan Chang |
2024-02-13 |
$2,842,000 |
| 11844199 |
Electronic device |
Li-Chieh Hung |
2023-12-12 |
$7,677,000 |
| 11733294 |
Package structure and testing method |
Tsung-Tang Tsai, Chih-Yi Huang |
2023-08-22 |
$2,504,000 |
| 11605877 |
Semiconductor device package and method of manufacturing the same |
Sheng-Chi Hsieh, Teck-Chong Lee, Chien-Hua Chen |
2023-03-14 |
$2,598,000 |
| 11515249 |
Wiring package and method of manufacturing the same |
Chih-Yi Huang, Mi-Chun Hung |
2022-11-29 |
$1,238,000 |
| 11424167 |
Semiconductor package structure and method for manufacturing the same |
Chih-Yi Huang, Keng-Tuan Chang |
2022-08-23 |
$3,173,000 |
| 11328999 |
Semiconductor device package |
Fu-Chen Chu, Hung-Chun KUO |
2022-05-10 |
$1,202,000 |
| 11232998 |
Semiconductor device package and method of manufacturing the same |
Ming-Fong JHONG, Hung-Chun KUO |
2022-01-25 |
$1,520,000 |
| 11222845 |
Semiconductor device package |
Po-I Wu |
2022-01-11 |
$1,882,000 |
| 10916429 |
Semiconductor device packages and stacked package assemblies including high density interconnections |
John Richard Hunt, William T. Chen, Chih-Pin Hung |
2021-02-09 |
$5,568,000 |
| 10903561 |
Semiconductor device package and method of manufacturing the same |
Chien-Hua Chen, Sheng-Chi Hsieh, Teck-Chong Lee |
2021-01-26 |
$1,725,000 |
| 10903152 |
Low loss substrate for high data rate applications |
Yuan-Hsi Chou, Tsun-Lung Hsieh |
2021-01-26 |
$1,725,000 |
| 10886263 |
Stacked semiconductor package assemblies including double sided redistribution layers |
William T. Chen, John Richard Hunt, Chih-Pin Hung, Chih-Yi Huang |
2021-01-05 |
$1,548,000 |
| 10535521 |
Semiconductor device packages and stacked package assemblies including high density interconnections |
John Richard Hunt, William T. Chen, Chih-Pin Hung |
2020-01-14 |
$2,507,000 |
| 10515806 |
Semiconductor device packages and stacked package assemblies including high density interconnections |
John Richard Hunt, William T. Chen, Chih-Pin Hung |
2019-12-24 |
$1,370,000 |
| 10276382 |
Semiconductor device packages and stacked package assemblies including high density interconnections |
John Richard Hunt, William T. Chen, Chih-Pin Hung |
2019-04-30 |
$1,812,000 |
| 10236240 |
Low loss substrate for high data rate applications |
Yuan-Hsi Chou, Tsun-Lung Hsieh |
2019-03-19 |
$2,773,000 |
| 10186779 |
Semiconductor device package and method of manufacturing the same |
Cheng-Yu Ho, Chun-Yen TING, Ming-Fong JHONG, Po-Chih PAN |
2019-01-22 |
$2,074,000 |
| 9968617 |
Local topical administration formulations containing indoxacarb |
Frank Guerino, Keith Freehauf, Roger Mervyn Sargent, Peter Andrew O'Neill, Robert D. Simmons |
2018-05-15 |
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| 9728451 |
Through silicon vias for semiconductor devices and manufacturing method thereof |
Ying-Te Ou |
2017-08-08 |
$2,860,000 |
| 8841751 |
Through silicon vias for semiconductor devices and manufacturing method thereof |
Ying-Te Ou |
2014-09-23 |
$3,341,000 |
