Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394676 | Semiconductor package structure and method for manufacturing the same | Chih-Yi Huang, Keng-Tuan Chang | 2025-08-19 |
| 12216157 | Package structure and testing method | Tsung-Tang Tsai, Chih-Yi Huang | 2025-02-04 |
| 12176305 | Semiconductor package with integrated voltage regulator device and separate bridge die | Pao-Nan Lee, Chang-Chi Lee | 2024-12-24 |
| 12132006 | Semiconductor package structure | Pao-Nan Lee, Chang-Chi Lee | 2024-10-29 |
| 11901245 | Semiconductor package structure and method for manufacturing the same | Chih-Yi Huang, Keng-Tuan Chang | 2024-02-13 |
| 11844199 | Electronic device | Li-Chieh Hung | 2023-12-12 |
| 11733294 | Package structure and testing method | Tsung-Tang Tsai, Chih-Yi Huang | 2023-08-22 |
| 11605877 | Semiconductor device package and method of manufacturing the same | Sheng-Chi Hsieh, Teck-Chong Lee, Chien-Hua Chen | 2023-03-14 |
| 11515249 | Wiring package and method of manufacturing the same | Chih-Yi Huang, Mi-Chun Hung | 2022-11-29 |
| 11424167 | Semiconductor package structure and method for manufacturing the same | Chih-Yi Huang, Keng-Tuan Chang | 2022-08-23 |
| 11328999 | Semiconductor device package | Fu-Chen Chu, Hung-Chun KUO | 2022-05-10 |
| 11232998 | Semiconductor device package and method of manufacturing the same | Ming-Fong JHONG, Hung-Chun KUO | 2022-01-25 |
| 11222845 | Semiconductor device package | Po-I Wu | 2022-01-11 |
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2021-02-09 |
| 10903152 | Low loss substrate for high data rate applications | Yuan-Hsi Chou, Tsun-Lung Hsieh | 2021-01-26 |
| 10903561 | Semiconductor device package and method of manufacturing the same | Chien-Hua Chen, Sheng-Chi Hsieh, Teck-Chong Lee | 2021-01-26 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chih-Pin Hung, Chih-Yi Huang | 2021-01-05 |
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2020-01-14 |
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2019-04-30 |
| 10236240 | Low loss substrate for high data rate applications | Yuan-Hsi Chou, Tsun-Lung Hsieh | 2019-03-19 |
| 10186779 | Semiconductor device package and method of manufacturing the same | Cheng-Yu Ho, Chun-Yen TING, Ming-Fong JHONG, Po-Chih PAN | 2019-01-22 |
| 9968617 | Local topical administration formulations containing indoxacarb | Frank Guerino, Keith Freehauf, Roger Mervyn Sargent, Peter Andrew O'Neill, Robert D. Simmons | 2018-05-15 |
| 9728451 | Through silicon vias for semiconductor devices and manufacturing method thereof | Ying-Te Ou | 2017-08-08 |
| 8841751 | Through silicon vias for semiconductor devices and manufacturing method thereof | Ying-Te Ou | 2014-09-23 |