Issued Patents All Time
Showing 1–25 of 336 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12391044 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Anthony M. Fuller | 2025-08-19 |
| 12343728 | Thermally controlled reagent release | Viktor Shkolnikov | 2025-07-01 |
| 12281851 | Loop heat pipe evaporator | Bradley Richard, William G. Anderson, Richard W. Bonner, III, Devin Pellicone, Greg Hoeschele +3 more | 2025-04-22 |
| 12263484 | Microfluidic devices | Viktor Shkolnikov, Michael W. Cumbie | 2025-04-01 |
| 12233598 | Processes for formation of molded panels by bringing release liner of mold chase in direct contact with protective layer | Michael W. Cumbie | 2025-02-25 |
| 12134274 | Molded structures with channels | Michael W. Cumbie, Michael G. Groh | 2024-11-05 |
| 12097711 | Fluid-ejection die with stamped nanoceramic layer | Michael G. Groh, Bo Song | 2024-09-24 |
| 12058207 | Load balancing and secure tunneling for cloud-based network controllers | Yu-Cheng Kung | 2024-08-06 |
| 11975468 | Coplanar modular printbars | Si-lam Choy, Michael W. Cumbie | 2024-05-07 |
| 11954847 | Image identification method and system | Wen-Jyi Hwang, Chien-Wei Chen | 2024-04-09 |
| 11904312 | Microfluidic devices with lid for loading fluid | Hilary Ely, Adam Higgins, Rachel M. White, Erik D. Torniainen, Tod Woodford +1 more | 2024-02-20 |
| 11827021 | Applying mold chase structure to end portion of fluid ejection die | Christopher A. Leonard, Anthony M. Fuller | 2023-11-28 |
| 11807523 | Three-dimensional features formed in molded panel | Devin Alexander Mourey, Michael G. Groh | 2023-11-07 |
| 11780226 | Fluid ejection devices | Michael G. Groh, Bo Song, Veronica Frances Burnett Krim | 2023-10-10 |
| 11780227 | Molded structures with channels | Michael W. Cumbie, Michael G. Groh | 2023-10-10 |
| 11745507 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Anthony M. Fuller | 2023-09-05 |
| 11721636 | Circuit die alignment target | Anthony M. Fuller, Michael W. Cumbie | 2023-08-08 |
| 11691423 | Uniform print head surface coating | Michael G. Groh, Bo Song | 2023-07-04 |
| 11691431 | Fluid circulation and ejection | Si-lam Choy, Michael W. Cumbie | 2023-07-04 |
| 11673107 | Sequential encapsulation of reagents | Viktor Shkolnikov | 2023-06-13 |
| 11666908 | Microfluidic package | Michael W. Cumbie | 2023-06-06 |
| 11654680 | Fluidic ejection dies with enclosed cross-channels | Si-Iam J. Choy, Michael W. Cumbie, Jeffrey R. Pollard | 2023-05-23 |
| 11642885 | Fluid ejection device including fluid output channel | Michael W. Cumbie | 2023-05-09 |
| 11637172 | Semiconductor device packages including an inductor and a capacitor | Teck-Chong Lee | 2023-04-25 |
| 11605877 | Semiconductor device package and method of manufacturing the same | Sheng-Chi Hsieh, Chen-Chao Wang, Teck-Chong Lee | 2023-03-14 |