CC

Chien-Hua Chen

HP HP: 254 patents #1 of 16,619Top 1%
AE Advanced Semiconductor Engineering: 28 patents #25 of 1,073Top 3%
AO Au Optronics: 7 patents #436 of 2,945Top 15%
BC Board-Tech Electronic Co.: 7 patents #1 of 2Top 50%
AT Advanced Cooling Technologies: 6 patents #3 of 48Top 7%
DE Delta Electronics: 6 patents #304 of 2,746Top 15%
ME Mediatek: 3 patents #879 of 2,888Top 35%
Foxconn: 3 patents #1,668 of 5,504Top 35%
NU National Taiwan University: 2 patents #404 of 2,195Top 20%
CU Chung Yuan Christian University: 2 patents #71 of 438Top 20%
UL United Defense Lp: 2 patents #13 of 134Top 10%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
TSMC: 1 patents #8,466 of 12,232Top 70%
TG Transpacific Ip Management Group: 1 patents #7 of 11Top 65%
CE Compal Electronics: 1 patents #443 of 873Top 55%
CT Chunghwa Picture Tubes: 1 patents #485 of 907Top 55%
GC Godex International Co.: 1 patents #3 of 8Top 40%
HC Helwett-Packard Development Company: 1 patents #1 of 24Top 5%
QD Quanta Display: 1 patents #36 of 120Top 30%
RH Ruckus Ip Holdings: 1 patents #11 of 87Top 15%
📍 Corvallis, OR: #3 of 1,763 inventorsTop 1%
🗺 Oregon: #19 of 28,073 inventorsTop 1%
Overall (All Time): #983 of 4,157,543Top 1%
336
Patents All Time

Issued Patents All Time

Showing 26–50 of 336 patents

Patent #TitleCo-InventorsDate
11597646 Microfluidic device with manifold Devin Alexander Mourey, Michael W. Cumbie, Si-lam Choy 2023-03-07
11597204 Fluid ejection polymeric recirculation channel Michael W. Cumbie, Si-Iam J. Choy 2023-03-07
11583861 Microfluidic devices Viktor Shkolnikov, Michael W. Cumbie 2023-02-21
11577252 Thermally controlled reagent release Viktor Shkolnikov 2023-02-14
11577456 Molded panels Michael W. Cumbie 2023-02-14
11565521 Fluid ejection device with a portioning wall Michael W. Cumbie 2023-01-31
11559987 Fluidic die with surface condition monitoring Eric Martin, Daryl E. Anderson, James R. Przybyla, Diane R. Hammerstad 2023-01-24
11548287 Fluidic die assemblies with rigid bent substrates Michael W. Cumbie 2023-01-10
11545427 Capacitor bank structure and semiconductor package structure Cheng-Yuan KUNG, Teck-Chong Lee, Hung-Yi Lin, Pao-Nan Lee, Hsin Hsiang Wang +2 more 2023-01-03
11541658 Fluidic die with nozzle layer electrode for fluid control Daryl E. Anderson, Eric Martin, James R. Przybyla 2023-01-03
11541659 Molded printhead Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey 2023-01-03
11502067 Package structure and method for manufacturing the same Cheng-Yuan KUNG 2022-11-15
11478793 Microfluidic devices Viktor Shkolnikov, Michael W. Cumbie 2022-10-25
11440009 Plurality of filters Michael W. Cumbie, Devin Alexander Mourey 2022-09-13
11440694 Device and method of test tube preparation Feng-Yi Tai 2022-09-13
11433571 Movable mold insert adjuster Jimmy Perez 2022-09-06
11433670 Conductive elements electrically coupled to fluidic dies Michael W. Cumbie, Randy Hoffman 2022-09-06
11426900 Molding a fluid flow structure Michael W. Cumbie, Arun Agarwal 2022-08-30
11408684 Loop heat pipe evaporator Bradley Richard, William G. Anderson, Richard W. Bonner, III, Devin Pellicone, Greg Hoeschele +3 more 2022-08-09
11390075 Fluidic dies Si-lam Choy, Michael W. Cumbie 2022-07-19
11390076 Fluid feed path wettability coating Michael G. Groh, Zhizhang Chen 2022-07-19
11390081 Fluid ejection device with a carrier having a slot Christopher A. Leonard, Anthony M. Fuller 2022-07-19
11364493 Planarization layers over silicon dies Michael W. Cumbie 2022-06-21
11364496 Coplanar fluidic interconnect Michael W. Cumbie, Viktor Shkolnikov 2022-06-21
11364497 Embedded microfluidic devices Michael W. Cumbie 2022-06-21