Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12391044 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Chien-Hua Chen | 2025-08-19 |
| 11827021 | Applying mold chase structure to end portion of fluid ejection die | Chien-Hua Chen, Christopher A. Leonard | 2023-11-28 |
| 11787180 | Corrosion tolerant micro-electromechanical fluid ejection device | Stanley Wang | 2023-10-17 |
| 11745507 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Chien-Hua Chen | 2023-09-05 |
| 11721636 | Circuit die alignment target | Michael W. Cumbie, Chien-Hua Chen | 2023-08-08 |
| 11642884 | Die for a printhead | Michael W. Cumbie, Scott A. Linn, James Michael Gardner | 2023-05-09 |
| 11639055 | Fluid ejection devices including contact pads | James Michael Gardner, Scott A. Linn, Michael W. Cumbie | 2023-05-02 |
| 11472180 | Fluid ejection devices including electrical interconnect elements for fluid ejection dies | Daren L. Forrest, Michael W. Cumbie, Michael Groom, Conrad Jenssen | 2022-10-18 |
| 11413864 | Die for a printhead | James Michael Gardner, Michael W. Cumbie, Scott A. Linn | 2022-08-16 |
| 11413865 | Fluid ejection devices including contact pads | James Michael Gardner, Scott A. Linn, Michael W. Cumbie | 2022-08-16 |
| 11390081 | Fluid ejection device with a carrier having a slot | Chien-Hua Chen, Christopher A. Leonard | 2022-07-19 |
| 11383514 | Die for a printhead | James Michael Gardner, Scott A. Linn | 2022-07-12 |
| 11267243 | Die for a printhead | James Michael Gardner, Michael W. Cumbie | 2022-03-08 |
| 11135839 | Die contact formations | Michael W. Cumbie, Chien-Hua Chen, Zhen Yi Li | 2021-10-05 |
| 11097537 | Fluid ejection die molded into molded body | Chien-Hua Chen, Michael W. Cumbie | 2021-08-24 |
| 10933634 | Conductive wire disposed in a layer | Terry McMahon, Donald W. Schulte, Amy Gault | 2021-03-02 |
| 10927472 | Method of forming a micro-structure | Peter Mardilovich, Qingqiao Wei | 2021-02-23 |
| 10864719 | Fluid ejection device including integrated circuit | Michael W. Cumbie, Chien-Hua Chen | 2020-12-15 |
| 10814629 | Termination ring with gapped metallic layer | Terry McMahon, Donald W. Schulte | 2020-10-27 |
| 10479080 | Fluid ejection device with ink feedhole bridge | Rio Rivas, Ed Friesen | 2019-11-19 |
| 10465308 | Adhesion-promoting surface | Peter Mardilovich, Qingqiao Wei | 2019-11-05 |
| 10287697 | Nano-structure and method of making the same | Peter Mardilovich, Qingqiao Wei, Irina Nikolaevna Milonova | 2019-05-14 |
| 10086612 | Fluid ejection device with ink feedhole bridge | Rio Rivas, Ed Friesen | 2018-10-02 |
| 9815282 | Fluid ejection structure | Bradley D. Chung, Galen P. Cook, Michael H. Hayes, Adam L. Ghozeil, Chantelle Domingue +2 more | 2017-11-14 |
| 9776402 | Thermal ink jet printhead | Lawrence H. White, Huyen Pham | 2017-10-03 |