Issued Patents All Time
Showing 51–75 of 336 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11358390 | Carriers including fluid ejection dies | Michael W. Cumbie | 2022-06-14 |
| 11351787 | Curved fluid ejection devices | Michael W. Cumbie, Si-Iam J. Choy | 2022-06-07 |
| 11331915 | Fluid ejection dies | Michael W. Cumbie | 2022-05-17 |
| 11325378 | Print head interposers | Michael W. Cumbie, Devin Alexander Mourey | 2022-05-10 |
| 11325125 | Particle separation | Viktor Shkolnikov | 2022-05-10 |
| 11318750 | Fluid property sensor | Michael W. Cumbie, Anthony D. Studer | 2022-05-03 |
| 11318469 | Selective release of material in thermally degradable capsule | Viktor Shkolnikov | 2022-05-03 |
| 11292265 | Fluid circulation and ejection | Si-lam Choy, Michael W. Cumbie | 2022-04-05 |
| 11292257 | Molded die slivers with exposed front and back surfaces | Michael W. Cumbie | 2022-04-05 |
| 11278892 | Chip to chip fluidic interconnect | Michael W. Cumbie, Viktor Shkolnikov | 2022-03-22 |
| 11278887 | Microfluidic chip | Viktor Shkolnikov, Michael W. Cumbie | 2022-03-22 |
| 11235574 | Fluid propelling apparatus including a heat sink | Garrett E. Clark, Michael W. Cumbie | 2022-02-01 |
| 11235328 | Coplanar microfluidic manipulation | Michael W. Cumbie, Viktor Shkolnikov | 2022-02-01 |
| 11227807 | Two-step molding for a lead frame | Michael W. Cumbie | 2022-01-18 |
| 11225086 | Thermal contact dies | Michael W. Cumbie, Reynaldo V Villavelez | 2022-01-18 |
| 11225074 | Fluidic dies with inlet and outlet channels | Michael W. Cumbie | 2022-01-18 |
| 11214065 | Fluid ejection die interlocked with molded body | Michael W. Cumbie | 2022-01-04 |
| 11215562 | Deformable covers on sensors and reservoirs | Michael W. Cumbie, Viktor Shkolnikov | 2022-01-04 |
| 11201125 | Semiconductor package and semiconductor process | Sheng-Chi Hsieh, Hung-Yi Lin, Cheng-Yuan KUNG, Pao-Nan Lee | 2021-12-14 |
| 11186090 | Fluid ejection device | Michael W. Cumbie, Erik D. Torniainen | 2021-11-30 |
| 11186082 | Conductive elements electrically coupled to fluidic dies | Michael W. Cumbie | 2021-11-30 |
| 11183437 | Circuit package | Michael W. Cumbie, Stephen Farrar | 2021-11-23 |
| 11155086 | Fluidic ejection devices with enclosed cross-channels | Si-Iam J. Choy, Michael W. Cumbie, Jeffrey R. Pollard | 2021-10-26 |
| 11148942 | Three-dimensional features formed in molded panel | Devin Alexander Mourey, Michael G. Groh | 2021-10-19 |
| 11135839 | Die contact formations | Michael W. Cumbie, Anthony M. Fuller, Zhen Yi Li | 2021-10-05 |