CC

Chien-Hua Chen

HP HP: 254 patents #1 of 16,619Top 1%
AE Advanced Semiconductor Engineering: 28 patents #25 of 1,073Top 3%
AO Au Optronics: 7 patents #436 of 2,945Top 15%
BC Board-Tech Electronic Co.: 7 patents #1 of 2Top 50%
AT Advanced Cooling Technologies: 6 patents #3 of 48Top 7%
DE Delta Electronics: 6 patents #304 of 2,746Top 15%
ME Mediatek: 3 patents #879 of 2,888Top 35%
Foxconn: 3 patents #1,668 of 5,504Top 35%
NU National Taiwan University: 2 patents #404 of 2,195Top 20%
CU Chung Yuan Christian University: 2 patents #71 of 438Top 20%
UL United Defense Lp: 2 patents #13 of 134Top 10%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
TSMC: 1 patents #8,466 of 12,232Top 70%
TG Transpacific Ip Management Group: 1 patents #7 of 11Top 65%
CE Compal Electronics: 1 patents #443 of 873Top 55%
CT Chunghwa Picture Tubes: 1 patents #485 of 907Top 55%
GC Godex International Co.: 1 patents #3 of 8Top 40%
HC Helwett-Packard Development Company: 1 patents #1 of 24Top 5%
QD Quanta Display: 1 patents #36 of 120Top 30%
RH Ruckus Ip Holdings: 1 patents #11 of 87Top 15%
📍 Corvallis, OR: #3 of 1,763 inventorsTop 1%
🗺 Oregon: #19 of 28,073 inventorsTop 1%
Overall (All Time): #983 of 4,157,543Top 1%
336
Patents All Time

Issued Patents All Time

Showing 76–100 of 336 patents

Patent #TitleCo-InventorsDate
11130339 Molded fluid flow structure Michael W. Cumbie, Silam J. Choy 2021-09-28
11110714 Preloaded storage container and print head to dispense fluid Jeffrey A. Nielsen, Michael W. Cumbie 2021-09-07
11097537 Fluid ejection die molded into molded body Michael W. Cumbie, Anthony M. Fuller 2021-08-24
11090929 Complex impedance detection Michael W. Cumbie, Devin Alexander Mourey 2021-08-17
11065883 Cross-die recirculation channels and chamber recirculation channels Jeffrey R. Pollard, Michael W. Cumbie, Si-lam Choy 2021-07-20
11059291 Fluidic ejection dies with enclosed cross-channels Si-lam Choy, Michael W. Cumbie, Jeffrey R. Pollard 2021-07-13
11046073 Fluid ejection die heat exchangers Michael W. Cumbie, James R. Przybyla 2021-06-29
11046084 Liquid level sensing Michael W. Cumbie, Devin Alexander Mourey, Anthony D. Studer 2021-06-29
11037846 Semiconductor package structure and method of manufacturing the same Hsu-Chiang Shih, Cheng-Yuan KUNG, Hung-Yi Lin 2021-06-15
11020967 Printhead Michael W. Cumbie 2021-06-01
11009383 Fluid property sensing with electrodes Michael W. Cumbie, Greg Scott Long 2021-05-18
11009382 Liquid level sensing Michael W. Cumbie, Robert N. K. Browning 2021-05-18
11007712 Three-dimensional (3D) printing with epoxy resin Qin Liu, Michael G. Monroe, Bruce Cowger 2021-05-18
10994541 Molded fluid flow structure with saw cut channel Michael W. Cumbie, Arun Agarwal 2021-05-04
10994539 Fluid flow structure forming method Michael W. Cumbie 2021-05-04
10964652 Semiconductor device package and method of manufacturing the same Sheng-Chi Hsieh 2021-03-30
10946658 Encapsulating a bonded wire with low profile encapsulation Michael W. Cumbie, Zhuqing Zhang 2021-03-16
10946648 Fluid ejection die fluid recirculation Michael W. Cumbie, Si-lam Choy 2021-03-16
10940438 Omniphobic membranes and application thereof Kuo-Lun Tung, Allen Huang, Liang Chen, Yi-Rui Chen, Che-Chen Hsu +1 more 2021-03-09
10933640 Fluid dispenser Michael W. Cumbie 2021-03-02
10903561 Semiconductor device package and method of manufacturing the same Sheng-Chi Hsieh, Chen-Chao Wang, Teck-Chong Lee 2021-01-26
10890486 Plasmonic nanostructure including sacrificial passivation coating Zhizhang Chen, James Elmer Abbott, Jr. 2021-01-12
10871449 SERS sensor apparatus with passivation film Zhizhang Chen, James Elmer Abbott, Jr. 2020-12-22
10864719 Fluid ejection device including integrated circuit Michael W. Cumbie, Anthony M. Fuller 2020-12-15
10861840 Integrated passive component and method for manufacturing the same Yung-Shun Chang, Teck-Chong Lee 2020-12-08