Issued Patents All Time
Showing 126–150 of 336 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10557391 | Incineration system and process | Bradley Richard, Howard Pearlman, Joel Crawmer | 2020-02-11 |
| 10559512 | Circuit package | Michael W. Cumbie, Stephen Farrar | 2020-02-11 |
| 10500859 | Molded die slivers with exposed front and back surfaces | Michael W. Cumbie | 2019-12-10 |
| 10495388 | Thermal energy storage system with tunable phase change composition | Ying Zheng, Howard Pearlman, Richard W. Bonner, III, Fangyu Cao | 2019-12-03 |
| 10493766 | Fluid level sensing with protective member | Michael W. Cumbie, Devin Alexander Mourey | 2019-12-03 |
| 10490341 | Electrical device | Cheng-Yuan KUNG, Hung-Yi Lin, Teck-Chong Lee, Sheng-Chi Hsieh | 2019-11-26 |
| 10479085 | Printhead electrical interconnects | Devin Alexander Mourey, Michael W. Cumbie | 2019-11-19 |
| 10479086 | Process for making a molded device assembly and printhead assembly | Thomas R. Strand, Michael G. Groh | 2019-11-19 |
| 10471714 | Printhead | Michael W. Cumbie | 2019-11-12 |
| 10472228 | MEMS device package and method for manufacturing the same | Cheng-Yuan KUNG, Che-Hau Huang, Chin-Cheng Kuo | 2019-11-12 |
| 10475718 | Semiconductor device package comprising a dielectric layer with built-in inductor | Hung-Yi Lin, Cheng-Yuan KUNG, Teck-Chong Lee, Shiuan-Yu LIN | 2019-11-12 |
| 10475734 | Semiconductor device package | Sheng-Chi Hsieh, Cheng-Yuan KUNG | 2019-11-12 |
| 10464324 | Molded fluid flow structure | Michael W. Cumbie | 2019-11-05 |
| 10434774 | Fluid ejection die and glass-based support substrate | Michael W. Cumbie | 2019-10-08 |
| 10438864 | Circuit packages comprising epoxy mold compounds and methods of compression molding | Michael W. Cumbie, Stephen Farrar | 2019-10-08 |
| 10427407 | Printer circuit board fluid ejection apparatus | Michael W. Cumbie, Devin Alexander Mourey | 2019-10-01 |
| 10421274 | Printbars and methods of forming printbars | Michael W. Cumbie | 2019-09-24 |
| 10421278 | Fluid ejection die and plastic-based substrate | Michael W. Cumbie, Devin Alexander Mourey | 2019-09-24 |
| 10421279 | Molded printhead | Michael W. Cumbie | 2019-09-24 |
| 10384450 | Inkjet printhead | Michael W. Cumbie, Diane R. Hammerstad | 2019-08-20 |
| 10377142 | Overmolded ink delivery device | Michael W. Cumbie, Devin Alexander Mourey | 2019-08-13 |
| 10369793 | Service structures in print heads | Devin Alexander Mourey, Michael W. Cumbie | 2019-08-06 |
| 10342140 | Printed circuit board to molded compound interface | Gary G. Lutnesky, Michael W. Cumbie, Eric L. Nikkel | 2019-07-02 |
| 10328694 | Printed circuit board with recessed pocket for fluid droplet ejection die | Diane R. Hammerstad, Randy M. Hoffman | 2019-06-25 |
| 10319657 | Circuit package having a plurality of epoxy mold compounds with different compositions | Michael W. Cumbie | 2019-06-11 |