| 12513815 |
Electronic device and method of manufacturing the same |
Hsu-Chiang Shih, Cheng-Yuan KUNG, Meng-Wei Hsieh, Ching-Te Huang, I-Ting Lin +1 more |
2025-12-30 |
|
| 12463157 |
Electronic package |
Meng-Wei Hsieh, Hsu-Chiang Shih, Cheng-Yuan KUNG |
2025-11-04 |
|
| 12456238 |
Image generation device and image generation method |
Handing Lin, Weijun Liu, Chao-yuan Tseng, Yanmin Chen |
2025-10-28 |
|
| 12374631 |
Semiconductor device package and method of manufacturing the same |
Hsu-Chiang Shih, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber |
2025-07-29 |
|
| 12368104 |
Electronic package |
Cheng-Yuan KUNG |
2025-07-22 |
|
| 12346520 |
Seamless touchpad device |
Chin-Wen Lin, Wei-Ting Wong, Ching-Fu Hsu |
2025-07-01 |
|
| 12229630 |
Reading method and reading device for two-dimensional code |
Chin-Hao Yeh, Chin-Wen Lin |
2025-02-18 |
|
| 12218075 |
Package structure |
Cheng-Yuan KUNG, Hsu-Chiang Shih, Chien-Mei Huang |
2025-02-04 |
|
| 12185047 |
Wearable component, ear tip, and method of manufacturing a wearable component |
Chang-Yi Wu, Jenchun Chen |
2024-12-31 |
$1,714,000 |
| 12105892 |
Electronic device |
Yi-Lun Lai, Cheng-Hui Wu, Huan-Hsun Huang, Yi-Ou Wang |
2024-10-01 |
|
| 12051658 |
Semiconductor package structure and method for manufacturing the same |
Cheng-Yuan KUNG |
2024-07-30 |
$4,295,000 |
| 11935841 |
Semiconductor package structure and method for manufacturing the same |
Cheng-Yuan KUNG, Meng-Wei Hsieh, Yu-Pin Tsai |
2024-03-19 |
$5,352,000 |
| 11824029 |
Semiconductor package structure |
Chi-Han Chen |
2023-11-21 |
$2,495,000 |
| 11798890 |
Assembly structure and package structure |
Cheng-Yuan KUNG |
2023-10-24 |
$1,728,000 |
| 11784111 |
Semiconductor device and method for manufacturing the same |
Cheng-Yuan KUNG, Chin-Cheng Kuo, Wu Chou Hsu |
2023-10-10 |
$1,593,000 |
| 11769712 |
Semiconductor package structure and method for manufacturing the same |
Hsiao-Yen Lee |
2023-09-26 |
$7,656,000 |
| 11722220 |
System comprising packaged optical devices |
Chang-Yu Lin, Cheng-Yuan KUNG |
2023-08-08 |
$1,262,000 |
| 11545427 |
Capacitor bank structure and semiconductor package structure |
Cheng-Yuan KUNG, Chien-Hua Chen, Teck-Chong Lee, Pao-Nan Lee, Hsin Hsiang Wang +2 more |
2023-01-03 |
$2,324,000 |
| 11508668 |
Semiconductor package structure and method for manufacturing the same |
Cheng-Yuan KUNG, Meng-Wei Hsieh, Yu-Pin Tsai |
2022-11-22 |
$2,343,000 |
| 11455046 |
Electronic device |
Ya-Ting Chen, Chien-Chih Tseng, Chun-Tsai Yeh, Wei Lin, Ming-Chieh Chen +2 more |
2022-09-27 |
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| 11435844 |
Electronic device and force sensing touch assembly thereof |
Ching-Fu Hsu, Wei-Ting Wong, Chun-Wei Li |
2022-09-06 |
|
| 11410594 |
Dynamic bias control of source driver based on data swing level for power saving |
Chun-Hung Chen, Chia-Hsin Tung, Hsin-Hung Ou |
2022-08-09 |
|
| 11402992 |
Control method, electronic device and non-transitory computer readable recording medium device |
Chun-Tsai Yeh, Meng-Ju Lu, Chien-Chih Tseng |
2022-08-02 |
|
| 11348885 |
Semiconductor package structure and method for manufacturing the same |
Cheng-Yuan KUNG |
2022-05-31 |
$3,890,000 |
| 11342282 |
Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same |
Hsu-Chiang Shih, Meng-Wei Hsieh, Yu-Sheng Chang, Hsiu-Chi Liu, Mark A. Gerber |
2022-05-24 |
$1,808,000 |