Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935841 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Meng-Wei Hsieh | 2024-03-19 |
| 11764311 | Optical device and electronic device | Tsung-Yueh Tsai, Teck-Chong Lee | 2023-09-19 |
| 11508668 | Semiconductor package structure and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Meng-Wei Hsieh | 2022-11-22 |
| 11133423 | Optical device and method of manufacturing the same | Tsung-Yueh Tsai, Teck-Chong Lee | 2021-09-28 |
| 11121111 | Semiconductor package structure and method of manufacturing the same | Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu | 2021-09-14 |
| 11088057 | Semiconductor package structure and method for manufacturing the same | Man-Wen TSENG, Yu-Ting Lu | 2021-08-10 |
| 10879215 | Method for manufacturing a semiconductor device package | Li-Hao Lyu, Chieh-Ju Tsai, Yu-Kai Lin, Wei-Ming Hsieh, Man-Wen TSENG +1 more | 2020-12-29 |
| 10395997 | Semiconductor process | Yu-Cheng Tsao, Cheng-Hung Wang, Chun-Chieh Lin, Hsiu-Hsiung Yang | 2019-08-27 |
| 10269771 | Semiconductor device package and a method of manufacturing the same | Li-Hao Lyu, Chieh-Ju Tsai, Yu-Kai Lin, Wei-Ming Hsieh, Man-Wen TSENG +1 more | 2019-04-23 |
| 10037975 | Semiconductor device package and a method of manufacturing the same | Wei-Ming Hsieh, Man-Wen TSENG | 2018-07-31 |
| 9564376 | Semiconductor process | Yu-Cheng Tsao, Cheng-Hung Wang, Chun-Chieh Lin, Hsiu-Hsiung Yang | 2017-02-07 |
| 8728915 | Wafer laser-making method and die fabricated using the same | Cheng-I Huang, Yao-Hui Hu | 2014-05-20 |
| 7842597 | Chip package, chip packaging, chip carrier and process thereof | — | 2010-11-30 |
| 7560818 | Stacked structure of chips and water structure for making the same | — | 2009-07-14 |
| 7510909 | Fabricating method of wafer protection layers | — | 2009-03-31 |
| 6691876 | Semiconductor wafer cassette | Chih-Min Pao, Ching-Feng Tseng, Fu Tang Chu | 2004-02-17 |