Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112965 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Yan-Ting Shen, Wen-Pin Huang | 2024-10-08 |
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Yan-Ting Shen, Wen-Pin Huang | 2023-02-21 |
| 11189518 | Method of processing a semiconductor wafer | Yan-Ting Shen, Bo Chen, Wen Han Yang | 2021-11-30 |
| 7749866 | Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple-type tape | Chi Yuam CHUNG | 2010-07-06 |
| 6691876 | Semiconductor wafer cassette | Yu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng | 2004-02-17 |
| 6476504 | Adhesive pattern for attaching semiconductor chip onto substrate | Ji-Ping Teng | 2002-11-05 |