Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243929 | Forming a dummy gate structure | Yu-Li Lin, Jui Fu Hsieh, Chih-Teng Liao | 2025-03-04 |
| 12112965 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Fu Tang Chu, Wen-Pin Huang | 2024-10-08 |
| 12015085 | Method of manufacturing a semiconductor device including etching polysilicon | Chia-Chi Yu, Chih-Teng Liao, Yu-Li Lin, Chih Hsuan Cheng, Tzu-Chan Weng | 2024-06-18 |
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Fu Tang Chu, Wen-Pin Huang | 2023-02-21 |
| 11430893 | Method of manufacturing a semiconductor device and a semiconductor device | Chia-Chi Yu, Chih-Teng Liao, Yu-Li Lin, Chih Hsuan Cheng, Tzu-Chan Weng | 2022-08-30 |
| 11189518 | Method of processing a semiconductor wafer | Bo Chen, Fu Tang Chu, Wen Han Yang | 2021-11-30 |
| 8080589 | Method for producing a bio-based polymeric shoe component | Shu-Yii Wu, Shih-Chien Chu, Ting-Yu Lee, Ming-Lei Wang, Ying-Ming Lu +1 more | 2011-12-20 |