Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183712 | Method and system for manufacturing a semiconductor package structure | Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu | 2024-12-31 |
| 11804461 | Semiconductor package structure and method of manufacturing the same | Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2023-10-31 |
| 11538787 | Method and system for manufacturing a semiconductor package structure | Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu | 2022-12-27 |
| 11121111 | Semiconductor package structure and method of manufacturing the same | Yu-Pin Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2021-09-14 |