Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183626 | Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same | Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho +1 more | 2024-12-31 |
| 11450558 | Metal interconnect structure and method for fabricating the same | Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho +1 more | 2022-09-20 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10784153 | Metal interconnect structure and method for fabricating the same | Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai, Kun-Chen Ho +1 more | 2020-09-22 |