Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183626 | Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Kun-Chen Ho +1 more | 2024-12-31 |
| 11450558 | Metal interconnect structure and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Kun-Chen Ho +1 more | 2022-09-20 |
| 10784153 | Metal interconnect structure and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Kun-Chen Ho +1 more | 2020-09-22 |
| 9316901 | Method for forming patterns | Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Kai-Lin Chuang | 2016-04-19 |
| 8748066 | Method for forming photomasks | Hsin-Yu Chen, Chia-Wei Huang, Chun-Hsien Huang, Kai-Lin Chuang | 2014-06-10 |
| 8735295 | Method of manufacturing dual damascene structure | Chang-Hsiao Lee, Hsin-Yu Chen, Yu-Tsung Lai, Jiunn-Hsiung Liao | 2014-05-27 |