Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183626 | Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai +1 more | 2024-12-31 |
| 11450558 | Metal interconnect structure and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai +1 more | 2022-09-20 |
| 10784153 | Metal interconnect structure and method for fabricating the same | Yi-How Chou, Tzu-Hao Fu, Tsung-Yin Hsieh, Chih-Sheng Chang, Shih-Chun Tsai +1 more | 2020-09-22 |