Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183607 | Semiconductor process system and method | Hsiao-Chi Huang, Han-Ming Liang | 2024-12-31 |
| 11302546 | Semiconductor process system and method | Hsiao-Chi Huang, Han-Ming Liang | 2022-04-12 |
| 10509420 | Reticle purging system and method thereof | Chun-Jung Huang, Yu-Yao Huang | 2019-12-17 |
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Fang Liu, Chia-Jen Cheng, Hsiu-Mei Yu | 2003-04-01 |