Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157839 | Interconnect structure and manufacturing method thereof | Hsiu-Mei Yu | 2018-12-18 |
| 9515038 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Hsiu-Mei Yu | 2016-12-06 |
| 9087882 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Hsiu-Mei Yu | 2015-07-21 |
| 8669658 | Crosstalk-free WLCSP structure for high frequency application | Mon-Chin Tsai, Hsiu-Mei Yo, Chien-Min Lin, Li-Hsin Tseng | 2014-03-11 |
| 8640569 | Freewheel structure | Tsung-Jen Chen | 2014-02-04 |
| 8624392 | Electrical connection for chip scale packaging | Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Hsiu-Mei Yu | 2014-01-07 |
| 7863742 | Back end integrated WLCSP structure without aluminum pads | Hsiu-Mei Yu, Tjandra Winata Karta, Daniel Yang, Shih-Ming Chen | 2011-01-04 |
| 7781140 | Method of fine pitch bump stripping | Chih-Min Tseng, Hsiu-Mei Yu, Wen-Hsiang Tseng, Yu-Lung Feng, Tung-Wen Hsieh | 2010-08-24 |
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Gil Huang, Huei-Mei Yu, Ken Sun, Chien-Tung Yu +4 more | 2008-12-02 |
| 7187078 | Bump structure | Tzu-Han Lin, Huei-Mei Yu, Chun-Yen Lo, Li-Hsin Tseng, Boe Su +1 more | 2007-03-06 |
| 7122458 | Method for fabricating pad redistribution layer | Hui-Mei Yu, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang WU, Chun-Yen Lo +2 more | 2006-10-17 |
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Shih-Ming Chin, Fang Liu, Hsiu-Mei Yu | 2003-04-01 |