HY

Hui-Mei Yu

TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #3,431,388 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7122458 Method for fabricating pad redistribution layer Chia-Jen Cheng, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang WU, Chun-Yen Lo +2 more 2006-10-17