Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406970 | Semiconductor package and method of bonding workpieces | Bingchien Wu, Wei-Jen Wu | 2025-09-02 |
| 12381191 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Bingchien Wu, Wei-Jen Wu | 2025-08-05 |
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Kuo-Chio Liu | 2024-09-10 |
| 11908843 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Bingchien Wu, Wei-Jen Wu | 2024-02-20 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2022-12-13 |
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou +3 more | 2021-12-28 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Kuo-Chio Liu | 2021-05-11 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2020-08-11 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Kuo-Chio Liu | 2020-01-14 |
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-12-25 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-01-23 |
| 7187078 | Bump structure | Tzu-Han Lin, Huei-Mei Yu, Chia-Jen Cheng, Li-Hsin Tseng, Boe Su +1 more | 2007-03-06 |
| 7122458 | Method for fabricating pad redistribution layer | Chia-Jen Cheng, Hui-Mei Yu, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang WU +2 more | 2006-10-17 |