Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Gil Huang, Chia-Jen Cheng, Ken Sun, Chien-Tung Yu +4 more | 2008-12-02 |
| 7187078 | Bump structure | Tzu-Han Lin, Chia-Jen Cheng, Chun-Yen Lo, Li-Hsin Tseng, Boe Su +1 more | 2007-03-06 |