Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Huei-Mei Yu, Chia-Jen Cheng, Ken Sun, Chien-Tung Yu +4 more | 2008-12-02 |
| 7456090 | Method to reduce UBM undercut | Blenny Chang, Hsiu-Mei Yu, Sung-Cheng Chiu | 2008-11-25 |
| 7378724 | Cavity structure for semiconductor structures | Hsiu-Mei Yu, Chien-Tung Yu, Owen Chen | 2008-05-27 |