Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Gil Huang, Huei-Mei Yu, Chia-Jen Cheng, Ken Sun +4 more | 2008-12-02 |
| 7456090 | Method to reduce UBM undercut | Hsiu-Mei Yu, Gil Huang, Sung-Cheng Chiu | 2008-11-25 |