Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7633165 | Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV | Kuo-Ching Hsu, Chen-Shien Chen, Hon-Lin Huang | 2009-12-15 |
| 7187078 | Bump structure | Tzu-Han Lin, Huei-Mei Yu, Chia-Jen Cheng, Chun-Yen Lo, Li-Hsin Tseng +1 more | 2007-03-06 |
| 7122458 | Method for fabricating pad redistribution layer | Chia-Jen Cheng, Hui-Mei Yu, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang WU +2 more | 2006-10-17 |