Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Chun-Yen Lo, Kuo-Chio Liu | 2024-09-10 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2022-12-13 |
| 11367658 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Cheng-Lin Huang | 2022-06-21 |
| 11349742 | Modem and communication method | — | 2022-05-31 |
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou +3 more | 2021-12-28 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Chun-Yen Lo, Kuo-Chio Liu | 2021-05-11 |
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Cheng-Lin Huang, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2020-08-11 |
| 10720360 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Cheng-Lin Huang | 2020-07-21 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Cheng-Lin Huang, Chun-Yen Lo, Kuo-Chio Liu | 2020-01-14 |
| 10510605 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Cheng-Lin Huang | 2019-12-17 |
| 10312118 | Bonding apparatus and method | Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang +3 more | 2019-06-04 |
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-12-25 |
| 10014218 | Method for forming semiconductor device structure with bumps | Meng-Fu Shih, Cheng-Lin Huang, Chien-Chen Li, Che-Jung Chu, Kuo-Chio Liu | 2018-07-03 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-01-23 |
| 9748130 | Wafer taping scheme | Wei-Chih Chen, Tung-Hsiao Yu, Min Wu | 2017-08-29 |
| 8859246 | Method to produce PHBV by recombinant Escherichia coli | Chih-Ching Chien, Po-Chi Soo, Yu-Tze Horng, Shan-Yu Chen, Hsiu-Hsiung Li +1 more | 2014-10-14 |
| 8387222 | Pen barrel assembling device | Steven Eugene Siddall | 2013-03-05 |
| 8086095 | Audio and video apparatus and method for controlling the same | CHUN-LUNG HUNG, Tao Wang, Shi-Ming Zhang, WANG-CHANG DUAN, Pei Liu | 2011-12-27 |
| 8072784 | Electronic device and power supply unit thereof | CHUN-LUNG HUNG, Tao Wang, WANG-CHANG DUAN, Qiang Huang, Shi-Ming Zhang | 2011-12-06 |
| 8073161 | Audio apparatus | CHUN-LUNG HUNG, De-An Zhang, Kun Wu Huang, Jie Liu, Shao-Lin Zhang | 2011-12-06 |
| 7916440 | Power interface circuit and electronic device using the same | CHUN-LUNG HUNG, Tao Wang, Shi-Ming Zhang, WANG-CHANG DUAN, Pei Liu | 2011-03-29 |
| 7804195 | Power supply system and protection method | CHUN-LUNG HUNG, WANG-CHANG DUAN, Tao Wang, Shi-Ming Zhang, Pei Liu | 2010-09-28 |
| 7663433 | Audio amplifier | CHUN-LUNG HUNG, Jie Liu, De-An Zhang, WANG-CHANG DUAN, Tao Wang | 2010-02-16 |
| 7396432 | Composite shadow ring assembled with dowel pins and method of using | Chang-Jung Li, Kun Fan, Wen-Chi Wang | 2008-07-08 |