Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu | 2025-09-30 |
| 12353134 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu | 2025-07-08 |
| 12197138 | Machine learning on overlay management | Tzu-Cheng Lin, Chien Rhone Wang, Kewei Zuo, Zi-Jheng Liu | 2025-01-14 |
| 12148651 | Chuck design and method for wafer | Chen-Hua Yu, Hung-Jui Kuo | 2024-11-19 |
| 12032295 | Optical lithography system and method of using the same | Hung-Jui Kuo, Ting-Yang Yu | 2024-07-09 |
| 11977333 | Semiconductor devices and methods of manufacturing | Hung-Jui Kuo, Hsing-Chieh Lee | 2024-05-07 |
| 11960211 | Optical lithography system and method of using the same | Hung-Jui Kuo, Ting-Yang Yu | 2024-04-16 |
| 11841618 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu | 2023-12-12 |
| 11842896 | Semiconductor devices and methods of manufacturing | Hung-Jui Kuo, Hsing-Chieh Lee | 2023-12-12 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu | 2023-11-21 |
| 11670541 | Methods of manufacturing semiconductor device using phase shift mask | Chun-Chieh Wang, Hung-Jui Kuo, Jaw-Jung Shin | 2023-06-06 |
| 11587818 | Chuck design and method for wafer | Chen-Hua Yu, Hung-Jui Kuo | 2023-02-21 |
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu | 2022-11-29 |
| 11215929 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu | 2022-01-04 |
| 11189521 | Methods of manufacturing redistribution circuit structures using phase shift mask | Chun-Chieh Wang, Hung-Jui Kuo, Jaw-Jung Shin | 2021-11-30 |
| 11158600 | Lithography process for semiconductor packaging and structures resulting therefrom | Hung-Jui Kuo, Ting-Yang Yu, Shih-Peng Tai, I-Chia Chen | 2021-10-26 |
| 11143965 | Optical lithography system for patterning semiconductor devices and method of using the same | Hung-Jui Kuo, Ting-Yang Yu | 2021-10-12 |
| 11145560 | Semiconductor device and methods of manufacturing | Hung-Jui Kuo, Hsing-Chieh Lee | 2021-10-12 |
| 11127688 | Semiconductor package and manufacturing method thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2021-09-21 |
| 11037877 | Package structure and method of manufacturing the same | Zi-Jheng Liu, Hung-Jui Kuo | 2021-06-15 |
| 10879166 | Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2020-12-29 |
| 10867793 | Semiconductor package and method of fabricating the same | Zi-Jheng Liu, Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2020-12-15 |
| 10861710 | Methods of manufacturing semiconductor devices | Hung-Jui Kuo, Chen-Cheng Kuo, De-Yuan Lu | 2020-12-08 |
| 10859922 | Lithography system and method | Chen-Hua Yu, Hung-Jui Kuo | 2020-12-08 |
| 10312118 | Bonding apparatus and method | Pei-Shan Wu, Yi-Ting Hu, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin +3 more | 2019-06-04 |