Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374596 | Semiconductor package and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin | 2025-07-29 |
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Yu-Hsiao Lin, Kuo-Chung Yee | 2025-07-29 |
| 12347801 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu, I-Chia Chen | 2025-07-01 |
| 12272613 | Thermal structure for semiconductor device and method of forming the same | Wei-Ming Wang, Yu-Hung Lin, Kuo-Chung Yee | 2025-04-08 |
| 12176299 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2024-12-24 |
| 11955401 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Tsung-Shu Lin, Yi-Chung Huang | 2024-04-09 |
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu, I-Chia Chen | 2023-06-20 |
| 11626341 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Tsung-Shu Lin, Yi-Chung Huang | 2023-04-11 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2023-02-21 |
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Der-Chyang Yeh, Tsung-Shu Lin, Yi-Chung Huang | 2022-03-29 |
| 11158600 | Lithography process for semiconductor packaging and structures resulting therefrom | Hung-Jui Kuo, Ming-Tan Lee, Ting-Yang Yu, I-Chia Chen | 2021-10-26 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Der-Chyang Yeh, Hsien-Wei Chen | 2018-12-25 |
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2018-12-25 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2018-05-29 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9812381 | Integrated fan-out package and method of fabricating the same | Chi-Hsi Wu, Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Chuen-De Wang | 2017-11-07 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2017-05-23 |
| 9653427 | Integrated circuit package with probe pad structure | Chi-Hsi Wu, Chen-Hua Yu, Hsiang-Fan Lee, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2016-12-20 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Hsiang-Fan Lee, Tang-Jung Chiu | 2016-03-08 |
| 6992329 | Multi-domain vertical alignment liquid crystal display | Yang-En Wu, Ming-Chou Wu | 2006-01-31 |
| 6977706 | In-plane switching mode liquid crystal display having heightened electrodes | Yang-En Wu | 2005-12-20 |