Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165990 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Szu-Po Huang | 2024-12-10 |
| 11961779 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2024-04-16 |
| 11916023 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2024-02-27 |
| 11587886 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Szu-Po Huang | 2023-02-21 |
| 11133237 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-09-28 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2021-06-15 |
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2020-12-15 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li | 2020-07-07 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Szu-Po Huang | 2020-04-21 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10340242 | Semiconductor device and method of manufacturing the same | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2019-07-02 |
| 10157813 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-12-18 |
| 9978660 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2018-05-22 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |
| 9653427 | Integrated circuit package with probe pad structure | Chi-Hsi Wu, Chen-Hua Yu, Shih-Peng Tai, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, An-Jhih Su, Kim Hong Chen +2 more | 2017-02-28 |
| 9401395 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-07-26 |
| 9281254 | Methods of forming integrated circuit package | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Shih-Peng Tai, Tang-Jung Chiu | 2016-03-08 |
| 9269762 | Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Chen-Jong Wang, Kuo-Chi Tu | 2016-02-23 |
| 9263415 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-02-16 |
| 9257409 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Chen-Jong Wang | 2016-02-09 |
| 8994146 | Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Chen-Jong Wang, Kuo-Chi Tu | 2015-03-31 |
| 8993405 | Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Chen-Jong Wang, Kuo-Chi Tu | 2015-03-31 |